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SNJ55450BJ

Texas Instruments

SNJ55450BJ by Texas Instruments

SNJ55450BJ by Texas Instruments is a military-grade peripheral driver with 14 terminals and a supply voltage of 5V. It operates b/w -55°C to 125°C, making it suitable for harsh environments. With bipolar technology and through-hole terminals, it is ideal for applications requiring precise signal control.

Median Price

$7.900

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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TEDSS.com

USA . 11 parts In-Stock

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$7.900

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Vyrian

USA . 4,046 parts In-Stock

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Digiode

USA . 628 parts In-Stock

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Sunrise Surplus Inc.

USA . 26 parts In-Stock

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MISTER SPROCKETS

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LWI Electronics Inc

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ECAB

Sweden . 6 parts In-Stock

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Ashlea Components Ltd

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Resion

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Electronic Expediters

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Standard Data Resources

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Distributors (Availability)

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Parana Technologies

USA . 2,052 parts In-Stock

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$3.832

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$4.320

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DigiPath Technology Company

USA . 233 parts In-Stock

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$4.220

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ChromeModa Solutions

Germany . 4,954 parts In-Stock

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$4.306

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$3.531

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IDEA Electronic Components Group

UK . 906 parts In-Stock

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$3.875

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AZTECH Wire

Italy . 880 parts In-Stock

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One Stop Electronics

USA . 1,357 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the SNJ55450BJ from Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile peripheral driver offers seamless integration and reliable performance in a variety of applications. With its durable ceramic package and military-grade temperature grade, this product ensures long-lasting durability and stability. Experience the value and benefits of this high-tech solution, providing customers with unmatched advantages and peace of mind. Upgrade your projects today with the SNJ55450BJ!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and are highly reliable, making this product suitable for harsh operating conditions.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures high quality and reliability, meeting stringent military standards.

Power Supplies (V): 5

Operating at a standard 5V voltage makes this product compatible with a wide range of systems.

No. of Terminals: 14

Having 14 terminals allows for sufficient connections and versatility in usage applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Temperature Grade: MILITARY

Designed to meet military standards, this product is rugged and reliable for mission-critical applications.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making this product ideal for applications requiring accurate signal processing.

Technical Specifications

Peripheral Drivers SNJ55450BJ attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-XDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55450BJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-113-4803, 5962011134803, 5962-01-202-8259, 5962012028259

NIIN

011134803, 012028259

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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