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SNJ55451BFK

Texas Instruments

SNJ55451BFK by Texas Instruments

SNJ55451BFK by Texas Instruments is a 20-terminal chip carrier with 2 functions, operating at temperatures from -55 to 125°C. It features open-collector outputs, a max supply voltage of 5.5V, and a max output current of 0.4A. Ideal for military-grade applications requiring AND gate-based peripheral drivers with sink output flow direction.

Median Price

$43.987

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 10 parts In-Stock

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Bristol Electronics

USA . 9 parts In-Stock

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$30.000

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Digiode

USA . 1,949 parts In-Stock

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$41.788

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Vyrian

USA . 4,301 parts In-Stock

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Microfarads

USA . 9 parts In-Stock

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Sogenti Electronics

Canada . 2 parts In-Stock

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LWI Electronics Inc

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Parana Technologies

USA . 288 parts In-Stock

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$8.779

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$9.465

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288

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DigiPath Technology Company

USA . 112 parts In-Stock

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$9.667

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$8.893

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ChromeModa Solutions

Germany . 1,531 parts In-Stock

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$9.864

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$8.088

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IDEA Electronic Components Group

UK . 316 parts In-Stock

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$9.864

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$9.371

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$8.878

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Corphita

USA . 3,973 parts In-Stock

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$39.588

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Kepictronics

USA . 9,000 parts In-Stock

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Lixinc

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Overview

Elevate your projects with the SNJ55451BFK by Texas Instruments, a premium quality peripheral driver that offers unmatched reliability and performance. Manufactured by industry leader Texas Instruments, this chip carrier package boasts military-grade screening levels and open-collector output characteristics for superior functionality. Ideal for a wide range of applications, this AND gate based peripheral driver provides customers with efficient power management and precise control. Say goodbye to limitations and hello to endless possibilities with the SNJ55451BFK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures durability and reliability in various operating conditions.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this peripheral driver can handle higher voltage requirements efficiently.

No. of Functions: 2

Having 2 functions allows for versatility and flexibility in driving peripheral devices or components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this peripheral driver suitable for demanding military applications.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics provide compatibility with a wide range of devices and circuit configurations.

Technical Specifications

Peripheral Drivers SNJ55451BFK attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.4 A

Nominal Output Peak Current Limit:

.5 A

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.025 us

Turn-on Time:

.025 us

Width:

8.89 mm

Trade Compliance

SNJ55451BFK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-470-2970, 5962014702970

NIIN

014702970

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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