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SNJ55460J

Texas Instruments

SNJ55460J by Texas Instruments

SNJ55460J by Texas Instruments is a MILITARY-grade BIPOLAR Peripheral Driver with 14 terminals, operating at -55 to 125 °C. It has a supply voltage of 5V and driver for 2 bits, suitable for applications requiring high-temperature resistance and precise signal control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,860

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Digiode

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,731

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$7.290

100+ parts

-

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375

$7.290

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Parana Technologies

USA . 1,331 parts In-Stock

1+ parts

$8.708

100+ parts

-

1k+ parts

$9.388

10k+ parts

-

1,331

$8.708

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$9.388

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DigiPath Technology Company

USA . 2,113 parts In-Stock

1+ parts

$9.588

100+ parts

$8.821

1k+ parts

-

10k+ parts

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2,113

$9.588

$8.821

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ChromeModa Solutions

Germany . 6,127 parts In-Stock

1+ parts

$9.784

100+ parts

$8.023

1k+ parts

-

10k+ parts

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6,127

$9.784

$8.023

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IDEA Electronic Components Group

UK . 884 parts In-Stock

1+ parts

$9.784

100+ parts

$9.295

1k+ parts

$8.806

10k+ parts

-

884

$9.784

$9.295

$8.806

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One Stop Electronics

USA . 1,178 parts In-Stock

1+ parts

$46.500

100+ parts

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1,178

$46.500

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Corphita

USA . 1,501 parts In-Stock

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1,501

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Overview

Elevate your electronics with the SNJ55460J by Texas Instruments, a top-tier manufacturer known for quality and reliability. This high-performance peripheral driver is designed to optimize your applications with precision and efficiency. With its advanced technology and military-grade temperature grade, this product offers unmatched value and benefits to customers seeking superior performance. Upgrade your projects today with the SNJ55460J and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material ensures high durability and reliability, making this product suitable for rugged industrial environments.

Screening Level: 38535Q/M; 38534H; 883B

With a high screening level, this product meets stringent quality and reliability standards, ensuring high performance and long-term stability.

Power Supplies (V): 5

Operating at a voltage of 5V, this product is compatible with standard power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for demanding industrial applications.

Technology: BIPOLAR

Bipolar technology ensures high-speed and accurate switching performance, making this product ideal for applications requiring precise control.

Technical Specifications

Peripheral Drivers SNJ55460J attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-XDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55460J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-024-5938, 5962010245938, 5962-01-088-7120, 5962010887120

NIIN

010245938, 010887120

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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