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SN74S274N

Texas Instruments

SN74S274N by Texas Instruments

SN74S274N by Texas Instruments is a DSP peripheral IC with 20 terminals in an in-line package. Operating temperature range of 0-70°C, TTL technology, and dual terminal position make it ideal for commercial applications requiring multiplier functionality.

Median Price

$14.729

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$9.478

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$9.952

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$9.384

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$9.478

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American Microsemiconductor Inc.

USA . 580 parts In-Stock

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$19.980

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Vyrian

USA . 8,618 parts In-Stock

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Digiode

USA . 603 parts In-Stock

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Electronic Expediters

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 509 parts In-Stock

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$7.986

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$7.986

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One Stop Electronics

USA . 1,522 parts In-Stock

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$19.000

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Corohmni

South Africa . 5,156 parts In-Stock

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$21.076

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Parana Technologies

USA . 642 parts In-Stock

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$28.583

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$49.186

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$28.583

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DigiPath Technology Company

USA . 298 parts In-Stock

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$31.474

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$28.956

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IDEA Electronic Components Group

UK . 1,420 parts In-Stock

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$32.116

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$30.510

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$28.904

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ChromeModa Solutions

Germany . 410 parts In-Stock

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$32.116

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Corphita

USA . 3,342 parts In-Stock

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J Silver Components DBA - Lantern Electronics

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Assy Fe

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Overview

Elevate your DSP peripherals with the SN74S274N by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers a product that exceeds expectations. Perfect for a wide range of applications, this DSP peripheral offers unmatched value and benefits to customers. Whether you're in need of high performance or reliable functionality, the SN74S274N is sure to meet your needs with its advanced technology and commercial-grade temperature grade. Upgrade your systems today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are lightweight and durable, making the product ideal for portable or rugged environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easier integration into electronic systems.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting various components and peripherals, enhancing overall functionality.

Package Style (Meter): IN-LINE

In-line package style simplifies the connection process and allows for easy installation within existing setups.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand heat and perform reliably in demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures that the product can function effectively even in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases the product's reliability by offering multiple connection options.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Having a DSP peripheral with multiplier capabilities enhances the processing power and efficiency of the product.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy soldering and connection to PCBs, simplifying the assembly process.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm enables straightforward and secure connections to other components or boards.

Technical Specifications

DSP Peripherals SN74S274N attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74S274N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-051-5707, 5962010515707

NIIN

010515707

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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