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TI32081WNL-2

Texas Instruments

TI32081WNL-2 by Texas Instruments

TI32081WNL-2 by Texas Instruments is a DSP Peripheral with 16-bit output data bus width, 10 MHz clock frequency, and operates at -40 to 85°C. Ideal for applications requiring high-speed signal processing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,338 parts In-Stock

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Digiode

USA . 3,306 parts In-Stock

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3,306

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Distributors (Availability)

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One Stop Electronics

USA . 580 parts In-Stock

1+ parts

$6.000

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580

$6.000

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AZTECH Wire

Italy . 576 parts In-Stock

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$13.998

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576

$13.998

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Corohmni

South Africa . 2,432 parts In-Stock

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$47.430

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2,432

$47.430

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Parana Technologies

USA . 1,814 parts In-Stock

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$53.323

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1,814

$53.323

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DigiPath Technology Company

USA . 2,357 parts In-Stock

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$58.716

100+ parts

$54.018

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2,357

$58.716

$54.018

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ChromeModa Solutions

Germany . 3,254 parts In-Stock

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$59.914

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$49.129

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3,254

$59.914

$49.129

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$59.914

100+ parts

$56.918

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$53.923

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2,172

$59.914

$56.918

$53.923

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Corphita

USA . 3,214 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TI32081WNL-2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers DSP Peripherals of unmatched quality and reliability. This versatile product offers endless possibilities for applications in various fields. From its durable plastic/epoxy body to its impressive output data bus width of 16, the TI32081WNL-2 ensures optimal performance in every task. Experience the seamless integration and superior functionality that this product provides, making it a valuable asset for all your projects. Elevate your work to new heights with the TI32081WNL-2 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with various power sources, offering flexibility in usage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and space utilization in electronic designs.

Output Data Bus Width: 16

The wide output data bus width of 16 bits enables high-speed data processing and efficient communication between components.

No. of Terminals: 24

The product has a sufficient number of terminals for connecting to other components, ensuring versatility in system integration.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation and mounting process, making it convenient for assembly.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures energy efficiency and compatibility with various power sources, enhancing reliability.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand challenging environmental conditions and ensure stable performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in cold environments, enhancing the product's versatility.

Terminal Position: DUAL

The dual terminal position provides enhanced connectivity options and flexibility in wiring configurations.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for a compact design and easy integration into space-constrained electronic devices.

Width: 15.24 mm

The product's compact width of 15.24 mm enables efficient PCB layout and space-saving in electronic designs.

External Data Bus Width: 16

The wide external data bus width of 16 bits ensures high-speed data transfer and efficient communication with external peripherals.

Maximum Clock Frequency: 10 MHz

The high maximum clock frequency of 10 MHz allows for fast data processing and efficient performance in demanding applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in typical commercial environments, making it suitable for a wide range of applications.

Peripheral IC Type: DSP PERIPHERAL, FLOATING POINT PROCESSOR

The product is designed as a DSP peripheral with a floating-point processor, offering advanced signal processing capabilities for enhanced performance.

Technology: NMOS

The NMOS technology used in the product provides high-speed operation and low power consumption, ideal for efficient data processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and ensures secure connections for reliable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy connection to standard spacing on PCBs, enhancing compatibility and ease of installation.

Technical Specifications

DSP Peripherals TI32081WNL-2 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

10 MHz

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T24

Low Power Mode:

NO

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TI32081WNL-2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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