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SN74LVC2G08DCUTE4

Texas Instruments

SN74LVC2G08DCUTE4 by Texas Instruments

SN74LVC2G08DCUTE4 by Texas Instruments is a logic gate with 2 functions and inputs, operating at 1.8V to 5.5V. It has a propagation delay of 4.7ns, output characteristics in 3-STATE, and can withstand temperatures from -40°C to 125°C. Ideal for automotive applications due to its small size and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,953 parts In-Stock

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Digiode

USA . 3,453 parts In-Stock

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Connector Distribution Corp

USA . 1,257 parts In-Stock

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Right Parts Inc.

USA . 1,257 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 30 parts In-Stock

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$8.121

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30

$8.121

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AZTECH Wire

Italy . 528 parts In-Stock

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$12.282

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Parana Technologies

USA . 968 parts In-Stock

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$27.914

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$41.618

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$27.914

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DigiPath Technology Company

USA . 788 parts In-Stock

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$30.737

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$28.278

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Ampacity Inc.

Singapore . 1,042 parts In-Stock

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$31.000

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One Stop Electronics

USA . 997 parts In-Stock

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$31.000

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Semicontronic

India . 461 parts In-Stock

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$31.000

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$30.225

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$30.070

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ChromeModa Solutions

Germany . 5,278 parts In-Stock

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$31.364

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

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$31.364

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$29.796

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$28.228

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QUARKTWIN TECHNOLOGY LTD

USA . 5,999 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

USA . 2,309 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

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Overview

Elevate your electronics projects with the high-quality SN74LVC2G08DCUTE4 logic gates by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior products that guarantee reliability and performance. Perfect for a wide range of applications, these logic gates offer fast propagation delays and low power consumption. Whether you're a hobbyist or a professional, this product provides exceptional value with its compact design, ease of use, and versatile capabilities. Upgrade your circuits today with Texas Instruments' SN74LVC2G08DCUTE4 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the logic gates, making them suitable for a variety of applications.

Propagation Delay At Nominal Supply: 4.7 ns

Fast propagation delay ensures efficient operation and quick response times, making the logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations and allows for various input combinations, making the logic gates versatile for different scenarios.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V helps in reducing power consumption and increases energy efficiency, ideal for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the logic gates can withstand harsh environmental conditions, making them suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the logic gates reliable and versatile.

Technical Specifications

Logic Gates SN74LVC2G08DCUTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN74LVC2G08DCUTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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