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SN74CB3Q3125PWRG4

Texas Instruments

SN74CB3Q3125PWRG4 by Texas Instruments

SN74CB3Q3125PWRG4 by Texas Instruments is a 4-function bus driver with 0.2 ns propagation delay at 2.5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and true output polarity. With a max operating temperature of 85°C and surface mount capability, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,340 parts In-Stock

1+ parts

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6,340

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Digiode

USA . 1,665 parts In-Stock

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1,665

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 879 parts In-Stock

1+ parts

$10.000

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-

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879

$10.000

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$16.257

100+ parts

$16.094

1k+ parts

$15.444

10k+ parts

-

1,500

$16.257

$16.094

$15.444

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$17.295

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444

$17.295

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One Stop Electronics

USA . 709 parts In-Stock

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$19.000

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709

$19.000

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Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

$27.753

100+ parts

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$39.625

10k+ parts

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1,615

$27.753

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$39.625

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DigiPath Technology Company

USA . 1,954 parts In-Stock

1+ parts

$30.559

100+ parts

$28.115

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1,954

$30.559

$28.115

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ChromeModa Solutions

Germany . 6,638 parts In-Stock

1+ parts

$31.183

100+ parts

$25.570

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6,638

$31.183

$25.570

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IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$31.183

100+ parts

$29.624

1k+ parts

$28.065

10k+ parts

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1,673

$31.183

$29.624

$28.065

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Andel Nordic

Denmark . 4,427 parts In-Stock

1+ parts

$41.139

100+ parts

-

1k+ parts

$39.493

10k+ parts

$39.493

4,427

$41.139

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$39.493

$39.493

A-Z Elektronik GmbH

Germany . 6,648 parts In-Stock

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6,648

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Corphita

USA . 3,643 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Microchip USA

USA . 977 parts In-Stock

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977

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Perfect Parts

USA . 31 parts In-Stock

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31

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Overview

Enhance your electronic designs with the SN74CB3Q3125PWRG4 by Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Crafted from high-quality materials and boasting a small outline package style, this versatile component is perfect for a wide range of applications. With a fast propagation delay of just 0.2 ns, true output polarity, and 3-state output characteristics, this product delivers exceptional performance and reliability. Trust in Texas Instruments' reputation for excellence and elevate your projects with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 0.2 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components, increasing cost-effectiveness and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage makes this product energy-efficient and suitable for low-power applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supplies allows for flexible integration into various systems with different voltage requirements.

No. of Terminals: 14

The sufficient number of terminals provides ample connectivity options, accommodating complex circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions, making the product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic implementation, enabling efficient control of signal flow in digital circuits.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures operation in extreme cold conditions, making the product versatile and reliable in different environments.

Technical Specifications

Bus Driver & Transceivers SN74CB3Q3125PWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

4 mA

Propagation Delay At Nominal Supply:

.2 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74CB3Q3125PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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