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SN74ALVC3651-10PQ

Texas Instruments

SN74ALVC3651-10PQ by Texas Instruments

SN74ALVC3651-10PQ by Texas Instruments is a 2Kx36 CMOS FIFO memory with 10ns cycle time and 3.3V nominal voltage. It is used in applications requiring bi-directional data transfer, such as communication systems and networking equipment.

Median Price

$92.588

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$82.300

1k+ parts

$73.640

10k+ parts

$69.300

180

-

$82.300

$73.640

$69.300

DigiKey

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$102.875

1k+ parts

$92.050

10k+ parts

$86.625

180

-

$102.875

$92.050

$86.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,232 parts In-Stock

1+ parts

$86.868

100+ parts

-

1k+ parts

-

10k+ parts

-

3,232

$86.868

-

-

-

Vyrian

USA . 3,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,251

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$1.994

100+ parts

-

1k+ parts

$2.523

10k+ parts

-

2,347

$1.994

-

$2.523

-

DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$2.195

100+ parts

$2.020

1k+ parts

-

10k+ parts

-

698

$2.195

$2.020

-

-

ChromeModa Solutions

Germany . 3,981 parts In-Stock

1+ parts

$2.240

100+ parts

$1.837

1k+ parts

-

10k+ parts

-

3,981

$2.240

$1.837

-

-

IDEA Electronic Components Group

UK . 1,419 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

$2.016

10k+ parts

-

1,419

$2.240

-

$2.016

-

Corphita

USA . 2,136 parts In-Stock

1+ parts

$82.296

100+ parts

-

1k+ parts

-

10k+ parts

-

2,136

$82.296

-

-

-

Component Stockers USA

USA . 150 parts In-Stock

1+ parts

$92.550

100+ parts

$87.000

1k+ parts

-

10k+ parts

-

150

$92.550

$87.000

-

-

Microchip USA

USA . 235 parts In-Stock

1+ parts

$153.110

100+ parts

$150.450

1k+ parts

$149.120

10k+ parts

$147.790

235

$153.110

$150.450

$149.120

$147.790

Overview

Get ahead of the competition with the Texas Instruments SN74ALVC3651-10PQ FIFO memory IC. With a reputation for quality and reliability, Texas Instruments delivers unmatched performance in a variety of applications. This versatile device offers a fast cycle time of 10 ns and operates at a nominal supply voltage of 3.3V, making it an ideal choice for high-speed data storage. Whether you're looking to streamline your data processing or improve system efficiency, the SN74ALVC3651-10PQ provides the value, benefits, and advantages you need to succeed. Upgrade your technology today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the FIFO.

Cycle Time: 10 ns

The fast cycle time of 10 ns ensures efficient data processing and quick retrieval of information, making this FIFO suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing control and coordination with other system components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides stable power to the FIFO, ensuring reliable operation in various settings.

Memory Width: 36

With a memory width of 36 bits, this FIFO can handle larger chunks of data at once, increasing data processing efficiency.

No. of Words: 2048 words

The large number of words that can be stored in this FIFO allows for ample storage capacity, making it suitable for applications requiring extensive data buffering.

Technical Specifications

FIFO SN74ALVC3651-10PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

7.5 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

PQFP132(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ALVC3651-10PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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