Loading...

SN74ALVC3651-10PCB

Texas Instruments

SN74ALVC3651-10PCB by Texas Instruments

SN74ALVC3651-10PCB by Texas Instruments is a 2Kx36 FIFO memory IC with 10ns cycle time and operates at 3.3V. It features a low profile flatpack package, GULL WING terminals, and is suitable for parallel data storage applications.

Median Price

$171.282

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18 parts In-Stock

1+ parts

$157.500

100+ parts

$148.050

1k+ parts

$138.600

10k+ parts

-

18

$157.500

$148.050

$138.600

-

DigiKey

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Verical

USA . 18 parts In-Stock

1+ parts

-

100+ parts

$185.063

1k+ parts

$173.250

10k+ parts

-

18

-

$185.063

$173.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,078 parts In-Stock

1+ parts

$173.736

100+ parts

-

1k+ parts

-

10k+ parts

-

3,078

$173.736

-

-

-

Vyrian

USA . 5,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,911

-

-

-

-

DigiKey Marketplace

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

$4.651

100+ parts

-

1k+ parts

$5.129

10k+ parts

-

1,857

$4.651

-

$5.129

-

ChromeModa Solutions

Germany . 2,989 parts In-Stock

1+ parts

$5.226

100+ parts

$4.285

1k+ parts

-

10k+ parts

-

2,989

$5.226

$4.285

-

-

IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$5.226

100+ parts

-

1k+ parts

$4.703

10k+ parts

-

640

$5.226

-

$4.703

-

Corphita

USA . 1,727 parts In-Stock

1+ parts

$164.592

100+ parts

-

1k+ parts

-

10k+ parts

-

1,727

$164.592

-

-

-

Microchip USA

USA . 403 parts In-Stock

1+ parts

$184.330

100+ parts

$179.410

1k+ parts

$176.950

10k+ parts

$174.500

403

$184.330

$179.410

$176.950

$174.500

DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.712

1k+ parts

-

10k+ parts

-

50

-

$4.712

-

-

Overview

Experience unparalleled quality and reliability with the SN74ALVC3651-10PCB by Texas Instruments, a leading manufacturer in the industry. This FIFO device offers fast cycle times of 10 ns and operates synchronously at a nominal supply voltage of 3.3V, making it ideal for a wide range of applications. With its compact square shape and low profile package style, this product maximizes space efficiency while delivering high performance. Trust in Texas Instruments to provide you with cutting-edge technology that exceeds expectations. Unlock the potential of your projects with the SN74ALVC3651-10PCB today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Cycle Time: 10 ns

The fast cycle time allows for quick data transfer and processing, improving overall performance and efficiency of the product.

Nominal Supply Voltage / Vsup: 3.3V

Operates at a common supply voltage, ensuring compatibility with a wide range of systems and reducing the need for additional power conversion components.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy efficient and suitable for battery-powered devices.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO design allows data to be read and written simultaneously, improving data handling and access speed.

Technical Specifications

FIFO SN74ALVC3651-10PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

7.5 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ALVC3651-10PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20