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SN74ACT72221L-15RJ

Texas Instruments

SN74ACT72221L-15RJ by Texas Instruments

SN74ACT72221L-15RJ by Texas Instruments is a FIFO chip with 1KX9 organization, 15 ns cycle time, and 66.7 MHz clock frequency. It operates synchronously at 5V and has a memory density of 9216 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$15.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,016 parts In-Stock

1+ parts

-

100+ parts

$14.930

1k+ parts

$13.360

10k+ parts

$12.580

6,016

-

$14.930

$13.360

$12.580

DigiKey

USA . 6,016 parts In-Stock

1+ parts

-

100+ parts

$16.310

1k+ parts

-

10k+ parts

-

6,016

-

$16.310

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,035 parts In-Stock

1+ parts

$15.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

$15.770

-

-

-

Vyrian

USA . 4,044 parts In-Stock

1+ parts

$16.600

100+ parts

-

1k+ parts

-

10k+ parts

-

4,044

$16.600

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$4.953

100+ parts

-

1k+ parts

$5.492

10k+ parts

-

1,554

$4.953

-

$5.492

-

DigiPath Technology Company

USA . 1,734 parts In-Stock

1+ parts

$5.454

100+ parts

-

1k+ parts

-

10k+ parts

-

1,734

$5.454

-

-

-

IDEA Electronic Components Group

UK . 1,995 parts In-Stock

1+ parts

$5.565

100+ parts

-

1k+ parts

$5.008

10k+ parts

-

1,995

$5.565

-

$5.008

-

ChromeModa Solutions

Germany . 1,275 parts In-Stock

1+ parts

$5.565

100+ parts

$4.563

1k+ parts

-

10k+ parts

-

1,275

$5.565

$4.563

-

-

Ampacity Inc.

Singapore . 7,634 parts In-Stock

1+ parts

$14.110

100+ parts

-

1k+ parts

-

10k+ parts

-

7,634

$14.110

-

-

-

Corphita

USA . 700 parts In-Stock

1+ parts

$14.940

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$14.940

-

-

-

Overview

Experience seamless data transfer and reliable performance with the SN74ACT72221L-15RJ by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products like this FIFO chip carrier, perfect for applications requiring fast and efficient data storage and retrieval. With a synchronous operating mode and 3-state output characteristics, this versatile chip ensures optimal functionality at a maximum clock frequency of 66.7 MHz. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resilience to the package, ensuring the safety of the components inside.

Cycle Time: 15 ns

Fast cycle time of 15 ns allows for quick and efficient data transfer within the FIFO system.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred and processed in a synchronized manner, reducing the chances of errors or data loss.

Maximum Clock Frequency (fCLK): 66.7 MHz

High clock frequency of 66.7 MHz enables rapid processing and data transfer speeds, making it suitable for applications requiring high performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the FIFO can operate within standard temperature ranges, making it suitable for regular commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FIFO energy-efficient and reliable for long-term use.

No. of Words: 1024 words

Having a capacity of 1024 words allows the FIFO to store a significant amount of data, making it suitable for applications requiring large data buffers.

Memory Width: 9

Memory width of 9 indicates the number of bits that can be accessed in parallel, improving data processing speed and efficiency.

Technical Specifications

FIFO SN74ACT72221L-15RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72221L-15RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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