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SN74ACT7202LA15RJ

Texas Instruments

SN74ACT7202LA15RJ by Texas Instruments

SN74ACT7202LA15RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can be used in applications requiring fast asynchronous data transfer. With a memory density of 9216 bits, it is suitable for commercial temperature grade environments.

Median Price

$7.475

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$5.980

1k+ parts

$5.350

10k+ parts

$5.030

480

-

$5.980

$5.350

$5.030

DigiKey

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$7.860

1k+ parts

-

10k+ parts

-

480

-

$7.860

-

-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$7.475

1k+ parts

$6.688

10k+ parts

$6.287

480

-

$7.475

$6.688

$6.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,063 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

-

3,063

$6.308

-

-

-

Vyrian

USA . 4,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,252

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,839 parts In-Stock

1+ parts

$4.697

100+ parts

-

1k+ parts

$5.182

10k+ parts

-

1,839

$4.697

-

$5.182

-

DigiPath Technology Company

USA . 243 parts In-Stock

1+ parts

$5.171

100+ parts

$4.758

1k+ parts

-

10k+ parts

-

243

$5.171

$4.758

-

-

ChromeModa Solutions

Germany . 6,621 parts In-Stock

1+ parts

$5.277

100+ parts

$4.327

1k+ parts

-

10k+ parts

-

6,621

$5.277

$4.327

-

-

IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$5.277

100+ parts

-

1k+ parts

$4.749

10k+ parts

-

1,614

$5.277

-

$4.749

-

Corphita

USA . 3,675 parts In-Stock

1+ parts

$5.976

100+ parts

-

1k+ parts

-

10k+ parts

-

3,675

$5.976

-

-

-

Overview

Unlock seamless data transfer and enhanced performance with the SN74ACT7202LA15RJ FIFO by Texas Instruments. Crafted with precision and expertise, this FIFO device offers a reliable solution for a wide range of applications. With a fast cycle time of 25 ns and a maximum clock frequency of 40 MHz, this chip carrier package ensures efficient data handling. Experience the convenience of asynchronous operation and the flexibility of parallel organization, making it ideal for various commercial-grade projects. Upgrade your systems with Texas Instruments' top-notch technology and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making the product suitable for a variety of environments.

Cycle Time: 25 ns

The fast cycle time of 25 ns ensures quick and efficient data processing, making this FIFO product ideal for applications requiring high-speed operation.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this FIFO product into existing systems.

Maximum Clock Frequency (fCLK): 40 MHz

The high maximum clock frequency of 40 MHz allows for rapid data transfer and processing, making this FIFO product suitable for demanding applications that require high performance.

Memory IC Type: OTHER FIFO

The use of a FIFO memory IC ensures efficient data storage and retrieval, making this product a reliable choice for applications that involve sequential data access.

Technical Specifications

FIFO SN74ACT7202LA15RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.4554 mm

Trade Compliance

SN74ACT7202LA15RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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