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SN74ABT125DBR

Texas Instruments

SN74ABT125DBR by Texas Instruments

SN74ABT125DBR by Texas Instruments is a 4-function bus driver with a propagation delay of 4.9 ns at 5V, suitable for industrial applications. It features a small outline package style, operates b/w -40 to 85°C, and has a max power supply current of 30mA.

Median Price

$0.479

Lifecycle Status

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28

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Arrow

USA . 799 parts In-Stock

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Texas Instruments

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Mouser Electronics

USA . 439 parts In-Stock

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$0.860

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$0.486

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$0.432

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$0.391

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Rochester

USA . 4,218 parts In-Stock

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$0.479

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DigiKey

USA . 4,218 parts In-Stock

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Verical

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Avnet

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Chip1Stop

Japan . 1,016 parts In-Stock

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RS (Exports)

UK . 30 parts In-Stock

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$0.320

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Digiode

USA . 487 parts In-Stock

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Nova Conductors

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R&J Components

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Vyrian

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Mil-Aero Solutions, Inc.

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DigiKey Marketplace

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Bristol Electronics

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Inventory MP

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Velocity Electronics

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Prism Electronics

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North Shore Components

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Dan-Mar Components

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Lighthouse Electronics, Inc.

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PC Components Company LLC

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Microfarads

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LWI Electronics Inc

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Semicontronic

India . 8,272 parts In-Stock

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Ampacity Inc.

Singapore . 7,891 parts In-Stock

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Corphita

USA . 1,683 parts In-Stock

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Continental Prestige Electronics

USA . 2,701 parts In-Stock

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Argo Parts USA

USA . 1,734 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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$0.408

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$0.388

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$0.368

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$0.363

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Microchip USA

USA . 2,120 parts In-Stock

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Andel Nordic

Denmark . 2,904 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 512 parts In-Stock

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ChromeModa Solutions

Germany . 2,077 parts In-Stock

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IDEA Electronic Components Group

UK . 2,051 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Enhance your electronic projects with the high-quality SN74ABT125DBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable products that meet the needs of professionals and hobbyists alike. This bus driver and transceiver offers fast propagation delay, 3-state output characteristics, and a compact design for easy integration. With a wide range of applications, from data communication to industrial automation, this versatile component provides value, efficiency, and performance for all your circuit needs. Experience the benefits of Texas Instruments technology with the SN74ABT125DBR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount compatibility.

No. of Functions: 4

Multiple functions in a single component reduce the need for additional components, simplifying circuit design and reducing costs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Optimized load capacitance for efficient signal transmission and reception.

Maximum I (ol): 64 Amp

High output current capability ensures compatibility with a variety of loads and applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the product to function reliably in harsh environmental conditions.

Technology: BICMOS

Utilizes advanced BICMOS technology for low power consumption and high performance.

Control Type: ENABLE LOW

Allows for easy control and operation of the bus driver and transceiver with an enable low signal.

Technical Specifications

Bus Driver & Transceivers SN74ABT125DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ABT125DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-651-4580, 5962016514580

NIIN

016514580

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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