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PAL16R4A-2MFKB

Texas Instruments

PAL16R4A-2MFKB by Texas Instruments

PAL16R4A-2MFKB by Texas Instruments is a TTL technology-based PLD with 40ns propagation delay, 64 product terms, and 16MHz clock frequency. Ideal for military applications due to MIL grading, it features 8 dedicated inputs and 4 I/O lines in a square chip carrier package.

Median Price

$51.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,493 parts In-Stock

1+ parts

$49.350

100+ parts

$43.867

1k+ parts

$32.255

10k+ parts

-

2,493

$49.350

$43.867

$32.255

-

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$53.330

1k+ parts

$47.720

10k+ parts

$44.910

5

-

$53.330

$47.720

$44.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,331 parts In-Stock

1+ parts

$46.882

100+ parts

-

1k+ parts

-

10k+ parts

-

3,331

$46.882

-

-

-

Vyrian

USA . 4,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,949

-

-

-

-

Resion

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,007 parts In-Stock

1+ parts

$14.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$14.430

-

-

-

Corphita

USA . 1,466 parts In-Stock

1+ parts

$44.415

100+ parts

-

1k+ parts

-

10k+ parts

-

1,466

$44.415

-

-

-

Microchip USA

USA . 2,723 parts In-Stock

1+ parts

$109.920

100+ parts

$108.010

1k+ parts

$107.050

10k+ parts

$106.090

2,723

$109.920

$108.010

$107.050

$106.090

Parana Technologies

USA . 985 parts In-Stock

1+ parts

$137.218

100+ parts

$12,742.812

1k+ parts

$123.497

10k+ parts

-

985

$137.218

$12,742.812

$123.497

-

DigiPath Technology Company

USA . 1,567 parts In-Stock

1+ parts

$151.094

100+ parts

$139.007

1k+ parts

-

10k+ parts

-

1,567

$151.094

$139.007

-

-

ChromeModa Solutions

Germany . 4,250 parts In-Stock

1+ parts

$154.178

100+ parts

$126.426

1k+ parts

-

10k+ parts

-

4,250

$154.178

$126.426

-

-

IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$154.178

100+ parts

$146.469

1k+ parts

$138.760

10k+ parts

-

1,122

$154.178

$146.469

$138.760

-

Overview

Unlock the power of advanced technology with the PAL16R4A-2MFKB by Texas Instruments. Designed with precision and expertise, this Programmable Logic Device offers unparalleled performance and reliability in a wide range of applications. From aerospace to industrial automation, this PLD is a game-changer, providing fast propagation delay and versatile output functions. Trust Texas Instruments for cutting-edge solutions that deliver exceptional value and efficiency. Experience seamless integration and superior functionality with the PAL16R4A-2MFKB - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures durability and reliability in various environmental conditions, making it a suitable choice for rugged applications.

Propagation Delay: 40 ns

With a low propagation delay, this PLD can quickly process input signals and produce output, enhancing overall system performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during product manufacturing.

Maximum Supply Voltage: 5.5 V

Operating within a maximum supply voltage of 5.5V ensures safe and stable performance without risking damage due to overvoltage.

Technology Used: TTL

TTL technology offers reliable logic functions and compatibility with a wide range of digital systems, making it a versatile choice for different applications.

No. of Inputs: 12

Having 12 inputs provides flexibility and scalability in designing logic circuits, accommodating a variety of input signals for processing.

Nominal Supply Voltage (V): 5

Operating with a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easier.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this PLD can withstand elevated temperatures without compromising performance, suitable for harsh environments.

Maximum Clock Frequency: 16 MHz

Supporting a high maximum clock frequency of 16MHz allows for fast operation and efficient processing of logic functions in time-critical applications.

Grading Of Temperature: MILITARY

Having military-grade temperature grading ensures reliability and performance in extreme temperature conditions, making it ideal for military and aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL16R4A-2MFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

16 MHz

Propagation Delay:

40 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL16R4A-2MFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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