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PADC32J45IRGZT

Texas Instruments

PADC32J45IRGZT by Texas Instruments

The Texas Instruments PADC32J45IRGZT is a 14-bit ADC with 2 analog in channels, operating from -40 to 85°C. It offers a sample rate of 160 MHz and supports industrial applications requiring high-speed data conversion. This chip carrier package with a very thin profile is ideal for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,762 parts In-Stock

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4,762

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Digiode

USA . 4,179 parts In-Stock

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4,179

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Distributors (Availability)

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One Stop Electronics

USA . 1,304 parts In-Stock

1+ parts

$3.000

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1,304

$3.000

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AZTECH Wire

Italy . 371 parts In-Stock

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$18.906

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371

$18.906

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Parana Technologies

USA . 121 parts In-Stock

1+ parts

$24.080

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$24.730

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121

$24.080

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$24.730

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$26.515

100+ parts

$24.394

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1,100

$26.515

$24.394

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

1+ parts

$27.056

100+ parts

$25.703

1k+ parts

$24.350

10k+ parts

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1,307

$27.056

$25.703

$24.350

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ChromeModa Solutions

Germany . 1,196 parts In-Stock

1+ parts

$27.056

100+ parts

$22.186

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1,196

$27.056

$22.186

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Corphita

USA . 3,168 parts In-Stock

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Microchip USA

USA . 105 parts In-Stock

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105

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Overview

Experience unparalleled precision and performance with the Texas Instruments PADC32J45IRGZT Analog-to-Digital Converter. Crafted by a renowned manufacturer, this cutting-edge device offers exceptional quality and reliability. Ideal for a wide range of applications, this converter provides customers with unmatched value and benefits. From its sleek design to its advanced features, the PADC32J45IRGZT delivers superior results, making it the perfect choice for your analog-to-digital conversion needs. Upgrade your systems today and unlock endless possibilities with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in connecting various external sources for conversion, making the product versatile.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the circuit board, ideal for compact designs.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board, allowing for better overall design layout.

No. of Bits: 14

With 14 bits resolution, the product can provide high accuracy in converting analog signals to digital, ensuring precise data acquisition.

No. of Terminals: 48

Having 48 terminals provides ample connection options and allows for versatile integration into different circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile package style ensures efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C makes the product suitable for industrial applications where higher temperature tolerance is required.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can withstand harsh environmental conditions, increasing its reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and ensures secure and stable mounting on the circuit board.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, the product offers a slim profile, ideal for space-constrained applications.

Width: 7 mm

The compact width of 7 mm allows for efficient space utilization on the circuit board and allows for a more streamlined design.

Length: 7 mm

The small length of 7 mm contributes to the overall compactness of the product, making it suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures the product can perform reliably in demanding environments.

Maximum Analog Input Voltage: 2 V

The high maximum analog input voltage of 2 V allows for the conversion of a wide range of analog signals, increasing the product's versatility.

Sample Rate: 160 MHz

With a high sample rate of 160 MHz, the product can handle fast analog signal processing, making it suitable for real-time applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and maintenance, reducing the risk of soldering errors and making the product user-friendly.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary method in the ADC ensures optimized conversion performance, offering superior accuracy and reliability.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8 V, the product is energy-efficient and can operate effectively with low power consumption.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting output bit codes like offset binary and 2's complement binary provides flexibility in data representation, catering to different system requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact layout design and efficient signal routing on the circuit board.

Minimum Analog Input Voltage: -2 V

The low minimum analog input voltage of -2 V enables the conversion of a wide range of analog signals, enhancing the product's adaptability.

Output Format: SERIAL

Supporting a serial output format simplifies data transmission and integration with other digital systems, enhancing the product's connectivity.

Technical Specifications

Analog-to-Digital Converters PADC32J45IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Trade Compliance

PADC32J45IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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