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ONET1101LRGER

Texas Instruments

ONET1101LRGER by Texas Instruments

ONET1101LRGER by Texas Instruments is a 24-terminal chip carrier with a very thin profile. It operates b/w -25°C to 100°C, supporting SDH and SONET applications. With a nominal voltage of 3.3V and max supply current of 118mA, it is ideal for telecom circuits in ATM/SONET/SDH systems.

Median Price

$6.298

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,479 parts In-Stock

1+ parts

$6.298

100+ parts

$5.135

1k+ parts

$3.423

10k+ parts

-

18,479

$6.298

$5.135

$3.423

-

Mouser Electronics

USA . 2,872 parts In-Stock

1+ parts

$7.950

100+ parts

$5.210

1k+ parts

$4.680

10k+ parts

$4.270

2,872

$7.950

$5.210

$4.680

$4.270

Rochester

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

$4.940

1k+ parts

$4.420

10k+ parts

$4.160

2,870

-

$4.940

$4.420

$4.160

DigiKey

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

$6.500

1k+ parts

-

10k+ parts

-

2,870

-

$6.500

-

-

Verical

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

$6.175

1k+ parts

$5.525

10k+ parts

$5.200

2,870

-

$6.175

$5.525

$5.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$4.512

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$4.512

-

-

-

Vyrian

USA . 2,192 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

-

2,192

$4.750

-

-

-

ComSIT Distribution GmbH

Germany . 1,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,573 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

-

2,573

$4.275

-

-

-

Parana Technologies

USA . 1,842 parts In-Stock

1+ parts

$9.084

100+ parts

-

1k+ parts

$9.742

10k+ parts

-

1,842

$9.084

-

$9.742

-

ChromeModa Solutions

Germany . 595 parts In-Stock

1+ parts

$10.207

100+ parts

$8.370

1k+ parts

-

10k+ parts

-

595

$10.207

$8.370

-

-

IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$10.207

100+ parts

$9.697

1k+ parts

$9.186

10k+ parts

-

568

$10.207

$9.697

$9.186

-

Perfect Parts

USA . 29,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,323

-

-

-

-

Kepictronics

USA . 8,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,041

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,874

-

-

-

-

Lixinc

USA . 3,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

-

-

-

-

DigiPath Technology Company

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

$9.203

1k+ parts

-

10k+ parts

-

1,119

-

$9.203

-

-

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unleash the power of seamless communication with the ONET1101LRGER by Texas Instruments. Crafted with precision and expertise, this ATM/SONET/SDH circuit offers unparalleled quality and reliability for your telecommunications needs. Whether you're diving into SDH or SONET applications, this chip carrier with a very thin profile is designed to exceed expectations. With a nominal supply voltage of 3.3V and a maximum supply current of 118mA, this innovative solution ensures optimal performance and efficiency. Elevate your telecom projects with the ONET1101LRGER and experience a new level of connectivity that delivers on both value and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount design makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 24

With 24 terminals, this product offers a sufficient number of connections for its intended application.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure soldering onto the PCB, enhancing overall product durability.

Maximum Seated Height: 1 mm

Low seated height minimizes the space occupied by the product on the PCB, optimizing board layout and airflow.

Width: 4 mm

Compact 4mm width makes the product suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the exposure of the product to high temperatures, reducing the risk of damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints and ensures the product can withstand the soldering process.

Length: 4 mm

Compact 4mm length further enhances space savings and allows for efficient PCB layout.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and optimal performance in telecommunications networks.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and eliminates potential health hazards associated with lead solder.

Maximum Supply Current: 118 mA

With a maximum supply current of 118mA, the product is suitable for low-power applications, contributing to energy efficiency.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM, SONET, and SDH circuits, ensuring compatibility and optimal performance in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V is commonly used in electronic devices, making the product compatible with a wide range of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise placement and soldering of the product on the PCB, ensuring reliable connections.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product is resistant to moisture during storage and soldering processes, maintaining its reliability.

Technical Specifications

ATM/SONET/SDH Circuits ONET1101LRGER attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

118 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET1101LRGER Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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