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MSP430F6778AIPZR

Texas Instruments

MSP430F6778AIPZR by Texas Instruments

MSP430F6778AIPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.551

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,000 parts In-Stock

1+ parts

$8.551

100+ parts

$7.469

1k+ parts

$5.151

10k+ parts

-

4,000

$8.551

$7.469

$5.151

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,118 parts In-Stock

1+ parts

$8.123

100+ parts

-

1k+ parts

-

10k+ parts

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4,118

$8.123

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-

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Vyrian

USA . 8,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,606

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,644 parts In-Stock

1+ parts

$7.696

100+ parts

-

1k+ parts

-

10k+ parts

-

2,644

$7.696

-

-

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AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$21.840

100+ parts

-

1k+ parts

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10k+ parts

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1,054

$21.840

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Parana Technologies

USA . 442 parts In-Stock

1+ parts

$42.747

100+ parts

-

1k+ parts

-

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442

$42.747

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-

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DigiPath Technology Company

USA . 986 parts In-Stock

1+ parts

$47.069

100+ parts

-

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10k+ parts

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986

$47.069

-

-

-

ChromeModa Solutions

Germany . 3,095 parts In-Stock

1+ parts

$48.030

100+ parts

$39.385

1k+ parts

-

10k+ parts

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3,095

$48.030

$39.385

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IDEA Electronic Components Group

UK . 1,063 parts In-Stock

1+ parts

$48.030

100+ parts

$45.628

1k+ parts

$43.227

10k+ parts

-

1,063

$48.030

$45.628

$43.227

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Corohmni

South Africa . 63 parts In-Stock

1+ parts

$50.111

100+ parts

-

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63

$50.111

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$53.548

100+ parts

$48.729

1k+ parts

$43.909

10k+ parts

-

870

$53.548

$48.729

$43.909

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Component Stockers USA

USA . 33 parts In-Stock

1+ parts

-

100+ parts

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33

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Overview

Elevate your projects with the Texas Instruments MSP430F6778AIPZR, a top-of-the-line microprocessor circuit that delivers unparalleled performance and reliability. Designed with cutting-edge technology and superior craftsmanship, this industrial-grade device boasts a wide range of peripherals including BOR, Comparator, DMA, RTC, Timer, and WDT, making it ideal for various applications. With its low profile, fine pitch package style and high-speed connectivity options like I2C, SPI, and UART, this versatile microcontroller ensures seamless operation and optimal functionality. Experience the ultimate in quality and innovation with the MSP430F6778AIPZR – your key to unlocking endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuits within the package, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for efficient assembly of the product on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Support for a high supply voltage allows for flexibility in power input options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square shape of the package helps in easy handling, placement, and alignment during assembly, contributing to overall manufacturing efficiency.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities, enabling the product to handle complex functions and calculations effectively.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and integration with various peripheral devices, expanding the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile and fine pitch, ideal for space-constrained applications and high-density PCB layouts.

Minimum Supply Voltage: 2.4 V

Support for a low supply voltage ensures efficient power consumption and compatibility with battery-operated devices, extending the product's usability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to perform reliably in harsh environmental conditions without risk of overheating.

CPU Family: MSP430

Being part of the MSP430 family, the product benefits from Texas Instruments' renowned low-power microcontroller architecture, offering energy-efficient operation for battery-powered applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6778AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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