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MSP430F6775IPZ

Texas Instruments

MSP430F6775IPZ by Texas Instruments

MSP430F6775IPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, and UART buses. Ideal for industrial applications requiring a low-profile design with a max supply voltage of 3.6 V.

Median Price

$10.472

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 520 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

520

$7.684

$6.264

$4.176

-

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$13.260

100+ parts

$7.590

1k+ parts

$7.220

10k+ parts

-

90

$13.260

$7.590

$7.220

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 575 parts In-Stock

1+ parts

$7.300

100+ parts

-

1k+ parts

-

10k+ parts

-

575

$7.300

-

-

-

Vyrian

USA . 5,437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,437

-

-

-

-

Schukat

Germany . 85 parts In-Stock

1+ parts

-

100+ parts

$5.508

1k+ parts

$5.298

10k+ parts

-

85

-

$5.508

$5.298

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,270 parts In-Stock

1+ parts

$6.916

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$6.916

-

-

-

Corohmni

South Africa . 966 parts In-Stock

1+ parts

$8.510

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$8.510

-

-

-

Microchip USA

USA . 2,374 parts In-Stock

1+ parts

$28.110

100+ parts

$27.710

1k+ parts

$27.510

10k+ parts

$27.310

2,374

$28.110

$27.710

$27.510

$27.310

Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

$43.714

100+ parts

-

1k+ parts

-

10k+ parts

-

1,612

$43.714

-

-

-

ChromeModa Solutions

Germany . 1,579 parts In-Stock

1+ parts

$49.117

100+ parts

$40.276

1k+ parts

-

10k+ parts

-

1,579

$49.117

$40.276

-

-

IDEA Electronic Components Group

UK . 250 parts In-Stock

1+ parts

$49.117

100+ parts

$46.661

1k+ parts

$44.205

10k+ parts

-

250

$49.117

$46.661

$44.205

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

-

100+ parts

$44.284

1k+ parts

-

10k+ parts

-

636

-

$44.284

-

-

Overview

Unlock the full potential of your applications with the MSP430F6775IPZ by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability, ensuring that your projects run smoothly every time. Whether you're looking to enhance your IoT devices, sensor networks, or industrial control systems, this versatile microprocessor circuit offers unmatched value, performance, and efficiency. With its advanced technology and innovative features, the MSP430F6775IPZ is the perfect choice for all your embedded system needs. Elevate your designs today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design for easy handling and installation.

Surface Mount: Yes

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for versatile applications.

Minimum Supply Voltage: 1.8 V

Allows for operation at lower power supply voltages, increasing energy efficiency.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and easier layout design.

Bit Size: 16

16-bit architecture allows for higher processing capability and performance.

Power Supplies (V): 2/3.3

Supports multiple power supply options to accommodate different system requirements.

No. of Terminals: 100

Sufficient number of terminals for versatile connectivity and interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile and fine pitch package design enables space-saving and high-density PCB layouts.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

CPU Family: MSP430

Utilizes efficient and reliable MSP430 CPU family for optimized processing and functionality.

ADC Channels: Yes

Integrated ADC channels for analog signal processing and conversion.

ROM Words: 131072

Large ROM capacity allows for storage of extensive program data and firmware.

RAM Words: 16

Sufficient RAM capacity for data storage and efficient processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes integrated peripheral ICs for enhanced functionality and connectivity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6775IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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