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MSP430F67671IPEUR

Texas Instruments

MSP430F67671IPEUR by Texas Instruments

MSP430F67671IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32768 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,903 parts In-Stock

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6,903

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Digiode

USA . 2,101 parts In-Stock

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2,101

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Distributors (Availability)

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One Stop Electronics

USA . 1,117 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,117

$7.000

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AZTECH Wire

Italy . 718 parts In-Stock

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$16.838

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718

$16.838

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Parana Technologies

USA . 1,424 parts In-Stock

1+ parts

$50.663

100+ parts

$4,704.851

1k+ parts

$45.597

10k+ parts

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1,424

$50.663

$4,704.851

$45.597

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DigiPath Technology Company

USA . 1,202 parts In-Stock

1+ parts

$55.786

100+ parts

$51.324

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1,202

$55.786

$51.324

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ChromeModa Solutions

Germany . 2,314 parts In-Stock

1+ parts

$56.925

100+ parts

$46.678

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2,314

$56.925

$46.678

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IDEA Electronic Components Group

UK . 2,072 parts In-Stock

1+ parts

$56.925

100+ parts

$54.079

1k+ parts

$51.232

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2,072

$56.925

$54.079

$51.232

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Corohmni

South Africa . 735 parts In-Stock

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$77.379

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735

$77.379

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Component Stockers USA

USA . 741 parts In-Stock

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$99.990

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741

$99.990

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Corphita

USA . 2,042 parts In-Stock

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2,042

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Microchip USA

USA . 164 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F67671IPEUR, a cutting-edge microprocessor circuit designed to elevate your projects to new heights. With its advanced technology and reliable performance, this versatile IC offers unrivaled quality and precision. Ideal for a wide range of applications, from IoT devices to industrial automation, this product ensures seamless operation and optimal efficiency. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the MSP430F67671IPEUR, where excellence meets ingenuity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can result in better performance and functionality.

Bit Size: 16

A larger bit size enables the product to handle more complex operations and calculations.

Minimum Operating Temperature: -40 °C

Can operate effectively in low temperature environments without any issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67671IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67671IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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