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MSP430F6766AIPEUR

Texas Instruments

MSP430F6766AIPEUR by Texas Instruments

MSP430F6766AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.169

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,011 parts In-Stock

1+ parts

$7.169

100+ parts

$5.844

1k+ parts

$3.896

10k+ parts

-

2,011

$7.169

$5.844

$3.896

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,363 parts In-Stock

1+ parts

$6.811

100+ parts

-

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2,363

$6.811

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Vyrian

USA . 8,355 parts In-Stock

1+ parts

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8,355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,239 parts In-Stock

1+ parts

$6.452

100+ parts

-

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3,239

$6.452

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Corohmni

South Africa . 991 parts In-Stock

1+ parts

$6.554

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991

$6.554

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AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$20.070

100+ parts

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552

$20.070

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Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$40.583

100+ parts

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2,067

$40.583

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ChromeModa Solutions

Germany . 1,325 parts In-Stock

1+ parts

$45.599

100+ parts

$37.391

1k+ parts

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1,325

$45.599

$37.391

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IDEA Electronic Components Group

UK . 1,021 parts In-Stock

1+ parts

$45.599

100+ parts

$43.319

1k+ parts

$41.039

10k+ parts

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1,021

$45.599

$43.319

$41.039

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Component Stockers USA

USA . 1,515 parts In-Stock

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1,515

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DigiPath Technology Company

USA . 757 parts In-Stock

1+ parts

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100+ parts

$41.112

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757

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$41.112

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Overview

Discover the cutting-edge MSP430F6766AIPEUR by Texas Instruments, a top-tier manufacturer known for superior quality and innovation. This versatile microprocessor circuit offers a wide range of applications in various industries. With advanced features like ADC channels, PWM channels, and connectivity options, this product delivers exceptional value and performance to customers. Experience seamless operation and reliability with the MSP430F6766AIPEUR, setting new standards in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for versatile power supply options.

No. of Terminals: 128

Provides ample connectivity options for peripherals and external devices.

ADC Channels: YES

Supports analog to digital conversion for sensing and measurement applications.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention.

ROM Words: 262144

Large program memory capacity for storing complex code.

RAM Words: 16

Sufficient temporary storage for data manipulation during program execution.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrates various peripheral functions within the IC for enhanced functionality.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels with adequate resolution for precise analog signal conversion.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Support for various communication protocols for interfacing with external devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6766AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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