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MSP430F6765AIPEU

Texas Instruments

MSP430F6765AIPEU by Texas Instruments

MSP430F6765AIPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.644

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$8.644

100+ parts

$7.047

1k+ parts

$4.698

10k+ parts

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758

$8.644

$7.047

$4.698

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 282 parts In-Stock

1+ parts

$8.212

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282

$8.212

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Vyrian

USA . 5,857 parts In-Stock

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5,857

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Distributors (Availability)

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Corphita

USA . 634 parts In-Stock

1+ parts

$7.780

100+ parts

-

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634

$7.780

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Corohmni

South Africa . 132 parts In-Stock

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$8.128

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132

$8.128

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AZTECH Wire

Italy . 1,179 parts In-Stock

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$17.690

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1,179

$17.690

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Microchip USA

USA . 1,791 parts In-Stock

1+ parts

$27.240

100+ parts

$26.850

1k+ parts

$26.650

10k+ parts

$26.460

1,791

$27.240

$26.850

$26.650

$26.460

Parana Technologies

USA . 631 parts In-Stock

1+ parts

$45.852

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631

$45.852

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DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$50.489

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798

$50.489

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IDEA Electronic Components Group

UK . 767 parts In-Stock

1+ parts

$51.519

100+ parts

$48.943

1k+ parts

$46.367

10k+ parts

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767

$51.519

$48.943

$46.367

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ChromeModa Solutions

Germany . 640 parts In-Stock

1+ parts

$51.519

100+ parts

$42.246

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640

$51.519

$42.246

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Overview

Experience the power of Texas Instruments with the MSP430F6765AIPEU, a versatile microprocessor circuit that offers unmatched quality and reliability. Ideal for industrial applications, this innovative product features advanced peripherals like BOR, RTC, and DMA channels for seamless integration into your projects. With its low profile package and high clock frequency, the MSP430F6765AIPEU provides exceptional performance while maintaining a compact design. Trust in Texas Instruments to deliver cutting-edge technology that drives your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and thermal stability to the product.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options for flexibility in different applications.

Package Shape: RECTANGULAR

Offers a standard shape for easy handling and assembly.

Bit Size: 16

Provides sufficient processing power for a variety of tasks.

No. of Terminals: 128

Offers ample connectivity options for interfacing with other components.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes various peripherals such as DMA channels, timers, and ADC channels for enhanced functionality.

ADC Channels: YES

Allows for analog signal processing, suitable for sensor interfacing and data acquisition.

DMA Channels: YES

Supports efficient data transfer and handling capability, improving overall system performance.

ROM Words: 131072

Large memory capacity for storing program instructions and data.

RAM Words: 16

Provides temporary storage for quick data access and manipulation.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers versatile communication interfaces for seamless integration with other devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6765AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6765AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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