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MSP430F67651IPZR

Texas Instruments

MSP430F67651IPZR by Texas Instruments

MSP430F67651IPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART bus compatibility for industrial applications requiring low power consumption. The package style is flatpack with a low profile and fine pitch design.

Median Price

$5.443

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,890 parts In-Stock

1+ parts

$5.443

100+ parts

$4.437

1k+ parts

$2.958

10k+ parts

-

4,890

$5.443

$4.437

$2.958

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,839 parts In-Stock

1+ parts

$5.171

100+ parts

-

1k+ parts

-

10k+ parts

-

4,839

$5.171

-

-

-

Vyrian

USA . 5,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,427

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,100 parts In-Stock

1+ parts

$4.559

100+ parts

-

1k+ parts

-

10k+ parts

-

5,100

$4.559

-

-

-

Corphita

USA . 3,068 parts In-Stock

1+ parts

$4.899

100+ parts

-

1k+ parts

-

10k+ parts

-

3,068

$4.899

-

-

-

AZTECH Wire

Italy . 159 parts In-Stock

1+ parts

$8.540

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$8.540

-

-

-

Microchip USA

USA . 2,098 parts In-Stock

1+ parts

$26.220

100+ parts

$26.050

1k+ parts

$25.970

10k+ parts

$25.890

2,098

$26.220

$26.050

$25.970

$25.890

Parana Technologies

USA . 1,282 parts In-Stock

1+ parts

$64.143

100+ parts

-

1k+ parts

-

10k+ parts

-

1,282

$64.143

-

-

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DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

$70.630

100+ parts

$64.979

1k+ parts

-

10k+ parts

-

2,177

$70.630

$64.979

-

-

ChromeModa Solutions

Germany . 5,614 parts In-Stock

1+ parts

$72.071

100+ parts

$59.098

1k+ parts

-

10k+ parts

-

5,614

$72.071

$59.098

-

-

IDEA Electronic Components Group

UK . 142 parts In-Stock

1+ parts

$72.071

100+ parts

$68.467

1k+ parts

$64.864

10k+ parts

-

142

$72.071

$68.467

$64.864

-

Overview

Experience the cutting-edge technology of Texas Instruments with the MSP430F67651IPZR microprocessor circuit. This versatile device offers a range of applications in various industries, providing unmatched performance and reliability. With its advanced features and high-quality construction, this product ensures seamless integration into your projects, delivering exceptional value and benefits. Trust Texas Instruments to deliver innovative solutions that exceed your expectations. Upgrade your designs today with the MSP430F67651IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic packages due to its durability and ability to protect the internal components from physical damage.

Surface Mount: YES

Surface mount technology allows for the components to be mounted directly onto the surface of a printed circuit board, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for a wider range of potential applications and compatibility with various voltage sources.

Package Shape: SQUARE

The square shape of the package offers a symmetrical design, making it easier to place on a circuit board and potentially saving space.

Bit Size: 16

A 16-bit architecture allows for higher precision and performance compared to lower bit sizes, making this product suitable for applications requiring more complex calculations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages makes this product versatile and adaptable to different power requirements in various systems.

No. of Terminals: 100

With a high number of terminals, there are plenty of connection points for interfacing with other components, enabling more functionality and flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile and fine pitch, suitable for applications where space is limited and high-density integration is required.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for operation in systems with low power requirements, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability and performance in harsh environments, making this product suitable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this product energy efficient and capable of handling complex tasks.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C allows for operation in extreme cold environments, adding to the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

ADC Channels: YES

Having ADC (Analog-to-Digital Converter) channels allows the product to process analog signals, making it suitable for applications that require accurate conversion of analog data.

Terminal Position: QUAD

The quad terminal position offers stability and secure mounting on the circuit board, reducing the risk of disconnection or damage.

ROM Words: 131072

With a large ROM (Read-Only Memory) capacity of 131,072 words, this product can store a significant amount of program data for efficient operation.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm allows for a slim profile and compact design, contributing to space-saving and integration capabilities.

RAM Words: 16

While the RAM (Random Access Memory) capacity of 16 words may be modest, it still provides temporary storage for data during operation, facilitating efficient processing.

Width: 14 mm

The compact width of 14 mm enables the product to fit into tight spaces and offers versatility in mounting options.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable solder joints during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for effective soldering and assembly of the components onto the circuit board.

Length: 14 mm

The compact length of 14 mm contributes to the overall small footprint of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making this product suitable for industrial applications where temperature fluctuations are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product can perform complex computational tasks and interface with various peripherals, making it versatile and capable of handling diverse applications.

RAM Bytes: 16384

The RAM capacity of 16,384 bytes provides ample temporary storage for data processing, allowing for efficient operation and multitasking.

Technology: CMOS

CMOS (Complementary Metal-Oxide-Semiconductor) technology offers low power consumption, high speed, and noise immunity, making this product energy-efficient and reliable in performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during the assembly process, ensuring reliable electrical contacts.

Maximum Supply Current: 11.75 mA

The low maximum supply current of 11.75 mA indicates efficient power usage, making this product suitable for battery-powered applications and energy-sensitive systems.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard voltage levels in electronic systems, offering ease of integration and operation.

ROM Programmability: FLASH

Having FLASH ROM programmability allows for reprogramming and updating the firmware, adding flexibility and longevity to the product's use.

Bus Compatibility: I2C; SPI; UART

Support for I2C, SPI, and UART bus interfaces enables versatile communication with other devices and peripherals, expanding the product's connectivity options.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and precise connections on the circuit board, enhancing the product's reliability and performance.

Moisture Sensitivity Level (MSL): 3

Being MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to maintain the product's integrity.

Speed: 25 rpm

Although listed as speed, 25 rpm is not a relevant term for this product category. It may be advisable to verify and cross-check this specification for accurate information regarding the product's performance metrics.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67651IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67651IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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