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MSP430F67481AIPEU

Texas Instruments

MSP430F67481AIPEU by Texas Instruments

MSP430F67481AIPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 810 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

810

$12.976

$11.335

$7.817

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,375 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

10k+ parts

-

4,375

$12.327

-

-

-

Vyrian

USA . 6,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,946 parts In-Stock

1+ parts

$11.678

100+ parts

-

1k+ parts

-

10k+ parts

-

4,946

$11.678

-

-

-

AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$15.610

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$15.610

-

-

-

Parana Technologies

USA . 999 parts In-Stock

1+ parts

$33.937

100+ parts

-

1k+ parts

$137.652

10k+ parts

-

999

$33.937

-

$137.652

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$37.369

100+ parts

$34.380

1k+ parts

-

10k+ parts

-

786

$37.369

$34.380

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-

IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$38.132

100+ parts

$36.225

1k+ parts

$34.319

10k+ parts

-

2,057

$38.132

$36.225

$34.319

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ChromeModa Solutions

Germany . 606 parts In-Stock

1+ parts

$38.132

100+ parts

$31.268

1k+ parts

-

10k+ parts

-

606

$38.132

$31.268

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-

Microchip USA

USA . 2,074 parts In-Stock

1+ parts

$40.900

100+ parts

$40.310

1k+ parts

$40.020

10k+ parts

$39.730

2,074

$40.900

$40.310

$40.020

$39.730

Corohmni

South Africa . 444 parts In-Stock

1+ parts

$61.485

100+ parts

-

1k+ parts

-

10k+ parts

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444

$61.485

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-

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Overview

Discover the cutting-edge MSP430F67481AIPEU by Texas Instruments, a versatile microprocessor circuit that offers unparalleled performance and reliability. With advanced features like multiple ADC channels, PWM channels, and connectivity options, this device is ideal for a wide range of industrial applications. Experience seamless operation with a nominal supply voltage of 3.3V and maximum clock frequency of 0.032768 MHz. Trust in Texas Instruments' reputation for quality and innovation, and unlock endless possibilities with the MSP430F67481AIPEU. Elevate your projects to new heights with this exceptional microprocessor circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a variety of applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

Package Shape: RECTANGULAR

Standard shape that can easily fit into existing designs.

CPU Family: MSP430

Known for low power consumption and high performance, ideal for battery-powered devices.

ROM Words: 524288

Large program memory size for storing complex algorithms and instructions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Versatile integration of multiple peripheral functions for enhanced functionality.

Analog To Digital Convertors: 6-Ch 10-Bit

Allows for precise analog signal conversion, suitable for sensor interfacing.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple communication interfaces for compatibility with various devices and systems.

Speed: 25 rpm

Capable of fast processing speeds for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67481AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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