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MSP430F6747IPEUR

Texas Instruments

MSP430F6747IPEUR by Texas Instruments

MSP430F6747IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words, 32768 RAM bytes, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,347 parts In-Stock

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5,347

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Digiode

USA . 3,751 parts In-Stock

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3,751

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Distributors (Availability)

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One Stop Electronics

USA . 1,217 parts In-Stock

1+ parts

$2.000

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1,217

$2.000

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AZTECH Wire

Italy . 608 parts In-Stock

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$6.136

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608

$6.136

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Parana Technologies

USA . 862 parts In-Stock

1+ parts

$34.324

100+ parts

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$146.929

10k+ parts

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862

$34.324

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$146.929

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DigiPath Technology Company

USA . 31 parts In-Stock

1+ parts

$37.795

100+ parts

$34.771

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31

$37.795

$34.771

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ChromeModa Solutions

Germany . 1,999 parts In-Stock

1+ parts

$38.566

100+ parts

$31.624

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1,999

$38.566

$31.624

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$38.566

100+ parts

$36.638

1k+ parts

$34.709

10k+ parts

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167

$38.566

$36.638

$34.709

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Corohmni

South Africa . 230 parts In-Stock

1+ parts

$62.073

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230

$62.073

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Corphita

USA . 4,434 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6747IPEUR, a high-quality microprocessor circuit that combines cutting-edge technology with reliability. Ideal for a wide range of applications, this MSP430 offers unparalleled performance and efficiency. With a maximum clock frequency of 25 MHz and low power consumption, this versatile device provides value and benefits to customers seeking top-notch solutions for their projects. Trust Texas Instruments for superior quality and innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into different system designs and layouts.

Bit Size: 16

16-bit processing capability allows for handling complex tasks and data efficiently.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling compatibility with different power sources.

No. of Terminals: 128

Sufficient terminals for connecting to peripherals and external components, enhancing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile design with fine pitch enhances space efficiency and PCB layout flexibility.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for operation in power-sensitive applications while maintaining performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability and performance in various environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 family signifies efficiency, low power consumption, and high performance for embedded applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ROM Words: 262144

Large ROM capacity enables storing significant amounts of program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height allows for slim and compact device designs.

Width: 14 mm

Moderate width enables space-efficient PCB layout and integration into various system designs.

Maximum Clock Frequency: 25 MHz

High clock frequency supports quick data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature facilitates proper soldering and connection integrity during assembly.

Length: 20 mm

Compact length allows for space-efficient placement on PCBs and within systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit design enhances the product's processing capabilities and versatility for different applications.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and processing requirements of embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides easy and reliable soldering connections during PCB assembly.

Maximum Supply Current: 11.75 mA

Low maximum supply current consumption for power-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable and common nominal supply voltage for convenient power requirements in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient updating of software and firmware.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enhances connectivity and interoperability with other devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact and precise connections on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, requiring standard handling precautions during assembly.

Speed: 25 rpm

High speed capability enables efficient data processing and system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6747IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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