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MSP430F6746IPEU

Texas Instruments

MSP430F6746IPEU by Texas Instruments

MSP430F6746IPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at a max frequency of 25 MHz, it is suitable for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact flatpack package.

Median Price

$7.955

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$9.117

100+ parts

$7.433

1k+ parts

$4.955

10k+ parts

-

758

$9.117

$7.433

$4.955

-

Rochester

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$6.200

1k+ parts

$5.550

10k+ parts

$5.220

556

-

$6.200

$5.550

$5.220

DigiKey

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$8.160

1k+ parts

-

10k+ parts

-

556

-

$8.160

-

-

Verical

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$7.750

1k+ parts

$6.938

10k+ parts

$6.525

556

-

$7.750

$6.938

$6.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,768 parts In-Stock

1+ parts

$6.536

100+ parts

-

1k+ parts

-

10k+ parts

-

3,768

$6.536

-

-

-

Vyrian

USA . 5,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,251

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,039 parts In-Stock

1+ parts

$6.192

100+ parts

-

1k+ parts

-

10k+ parts

-

4,039

$6.192

-

-

-

Corohmni

South Africa . 2,089 parts In-Stock

1+ parts

$7.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

$7.570

-

-

-

Component Stockers USA

USA . 576 parts In-Stock

1+ parts

$7.880

100+ parts

$7.410

1k+ parts

-

10k+ parts

-

576

$7.880

$7.410

-

-

Microchip USA

USA . 1,846 parts In-Stock

1+ parts

$22.290

100+ parts

$21.970

1k+ parts

$21.810

10k+ parts

$21.650

1,846

$22.290

$21.970

$21.810

$21.650

Parana Technologies

USA . 184 parts In-Stock

1+ parts

$67.373

100+ parts

-

1k+ parts

-

10k+ parts

-

184

$67.373

-

-

-

DigiPath Technology Company

USA . 2,166 parts In-Stock

1+ parts

$74.186

100+ parts

$68.251

1k+ parts

-

10k+ parts

-

2,166

$74.186

$68.251

-

-

IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$75.700

100+ parts

$71.915

1k+ parts

$68.130

10k+ parts

-

1,729

$75.700

$71.915

$68.130

-

ChromeModa Solutions

Germany . 513 parts In-Stock

1+ parts

$75.700

100+ parts

$62.074

1k+ parts

-

10k+ parts

-

513

$75.700

$62.074

-

-

Overview

Unlock the power of innovation with the MSP430F6746IPEU by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile microprocessor circuit offers a wide range of applications, providing customers with unparalleled value and benefits. With its advanced technology and high-performance capabilities, the MSP430F6746IPEU is the perfect solution for all your electronic needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, reducing the overall weight of the device while ensuring reliability.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of power sources.

CPU Family: MSP430

The use of MSP430 CPU family ensures efficient and reliable performance, making it a suitable choice for various applications requiring microprocessor circuits.

ADC Channels: YES

The presence of ADC channels enables the device to convert analog signals to digital data, enhancing its versatility in data acquisition and processing.

ROM Programmability: FLASH

The ROM programmability feature using FLASH technology allows for easy and efficient reprogramming of the read-only memory, providing flexibility for firmware updates and customization.

Bus Compatibility: I2C; SPI; UART

The support for multiple bus interfaces such as I2C, SPI, and UART allows for seamless communication with external devices, expanding the connectivity options for the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6746IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6746IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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