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MSP430F6746AIPEUR

Texas Instruments

MSP430F6746AIPEUR by Texas Instruments

MSP430F6746AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.169

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,971 parts In-Stock

1+ parts

$7.169

100+ parts

$5.844

1k+ parts

$3.896

10k+ parts

-

1,971

$7.169

$5.844

$3.896

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,850 parts In-Stock

1+ parts

$6.811

100+ parts

-

1k+ parts

-

10k+ parts

-

3,850

$6.811

-

-

-

Vyrian

USA . 7,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,797

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,719 parts In-Stock

1+ parts

$6.452

100+ parts

-

1k+ parts

-

10k+ parts

-

3,719

$6.452

-

-

-

Corohmni

South Africa . 2,401 parts In-Stock

1+ parts

$6.554

100+ parts

-

1k+ parts

-

10k+ parts

-

2,401

$6.554

-

-

-

AZTECH Wire

Italy . 115 parts In-Stock

1+ parts

$8.770

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$8.770

-

-

-

Microchip USA

USA . 1,875 parts In-Stock

1+ parts

$17.080

100+ parts

$16.830

1k+ parts

$16.710

10k+ parts

$16.590

1,875

$17.080

$16.830

$16.710

$16.590

Parana Technologies

USA . 2,051 parts In-Stock

1+ parts

$43.361

100+ parts

-

1k+ parts

-

10k+ parts

-

2,051

$43.361

-

-

-

DigiPath Technology Company

USA . 2,326 parts In-Stock

1+ parts

$47.746

100+ parts

-

1k+ parts

-

10k+ parts

-

2,326

$47.746

-

-

-

ChromeModa Solutions

Germany . 2,274 parts In-Stock

1+ parts

$48.720

100+ parts

$39.950

1k+ parts

-

10k+ parts

-

2,274

$48.720

$39.950

-

-

IDEA Electronic Components Group

UK . 263 parts In-Stock

1+ parts

$48.720

100+ parts

$46.284

1k+ parts

$43.848

10k+ parts

-

263

$48.720

$46.284

$43.848

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QUARKTWIN TECHNOLOGY LTD

USA . 26,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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26,873

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-

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Component Stockers USA

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.140

10k+ parts

-

1,536

-

-

$4.140

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Overview

Unlock the endless possibilities with the MSP430F6746AIPEUR by Texas Instruments. This high-quality microprocessor circuit offers unparalleled performance, reliability, and efficiency for a wide range of applications. With advanced features such as 6-ch 10-bit ADC, 3 DMA channels, and 4 timer peripherals, this versatile device empowers you to innovate with ease. Whether you're developing IoT devices, smart sensors, or industrial automation systems, this compact yet powerful IC is your ultimate solution. Trust in Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your designs and stay ahead of the competition with the MSP430F6746AIPEUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and improving overall efficiency.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, providing flexibility in different operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle, facilitating the IC's integration into electronic devices.

No. of Terminals: 128

Having a high number of terminals allows for more connectivity options and functions, enhancing the versatility of the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in operation.

ADC Channels: YES

The presence of Analog-to-Digital Converters (ADC) enables the IC to process analog signals, expanding its capabilities for sensor interfacing and data acquisition.

RAM Bytes: 16384

With a large RAM capacity, the IC can efficiently handle data storage and processing tasks, enhancing its performance in various applications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options such as I2C, IRDA, SPI, and UART facilitate communication with other devices, improving the compatibility and versatility of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6746AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6746AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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