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MSP430F6745IPEUR

Texas Instruments

MSP430F6745IPEUR by Texas Instruments

MSP430F6745IPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words, 16384 RAM bytes, and a max clock frequency of 25 MHz. It is ideal for industrial applications requiring a low-profile, fine-pitch package style with I2C, SPI, and UART bus compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,667 parts In-Stock

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Digiode

USA . 3,526 parts In-Stock

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AZTECH Wire

Italy . 472 parts In-Stock

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$12.416

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One Stop Electronics

USA . 1,511 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,412 parts In-Stock

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$65.440

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DigiPath Technology Company

USA . 2,033 parts In-Stock

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$72.057

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ChromeModa Solutions

Germany . 6,278 parts In-Stock

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$73.528

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$60.293

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IDEA Electronic Components Group

UK . 293 parts In-Stock

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$73.528

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$69.852

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$66.175

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293

$73.528

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$66.175

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Corohmni

South Africa . 1,911 parts In-Stock

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$77.225

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Component Stockers USA

USA . 455 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the possibilities of advanced technology with the Texas Instruments MSP430F6745IPEUR. This high-quality microprocessor circuit offers unparalleled performance and versatility, making it ideal for a wide range of applications. From IoT devices to industrial automation, this product provides reliable and efficient operation, giving customers the value and benefits they need to succeed in today's fast-paced market. Trust in Texas Instruments for cutting-edge solutions that drive innovation and deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to physical damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this product can handle higher power requirements and support a wider range of applications.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, making it suitable for space-constrained designs.

Bit Size: 16

16-bit architecture offers higher processing capabilities and efficiency compared to lower bit sizes, enabling faster execution of instructions.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) provides flexibility in powering the device according to system requirements.

No. of Terminals: 128

Having 128 terminals allows for a greater number of connections and functionalities, enabling the product to interface with a variety of external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances the product's thermal performance, signal integrity, and overall reliability in high-density designs.

Minimum Supply Voltage: 1.8 V

With a minimum supply voltage of 1.8 V, the product remains operational even under lower power conditions, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the product to function reliably in industrial environments with elevated temperatures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6745IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6745IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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