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MSC1214Y3PAGRG4

Texas Instruments

MSC1214Y3PAGRG4 by Texas Instruments

The Texas Instruments MSC1214Y3PAGRG4 microcontroller features 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. Ideal for automotive applications, it offers DAC and ADC channels, with a temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,651 parts In-Stock

1+ parts

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2,651

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Vyrian

USA . 2,486 parts In-Stock

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2,486

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$19.121

100+ parts

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604

$19.121

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One Stop Electronics

USA . 1,205 parts In-Stock

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$26.000

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1,205

$26.000

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Parana Technologies

USA . 48 parts In-Stock

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$26.519

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$27.096

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48

$26.519

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$27.096

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ChromeModa Solutions

Germany . 1,961 parts In-Stock

1+ parts

$29.797

100+ parts

$24.434

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1,961

$29.797

$24.434

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IDEA Electronic Components Group

UK . 83 parts In-Stock

1+ parts

$29.797

100+ parts

$28.307

1k+ parts

$26.817

10k+ parts

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83

$29.797

$28.307

$26.817

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Component Stockers USA

USA . 367 parts In-Stock

1+ parts

$99.990

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367

$99.990

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DigiPath Technology Company

USA . 2,172 parts In-Stock

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$26.865

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2,172

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$26.865

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Corphita

USA . 1,465 parts In-Stock

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Microchip USA

USA . 437 parts In-Stock

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437

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Overview

Discover the innovative MSC1214Y3PAGRG4 by Texas Instruments, a top-quality microcontroller designed to deliver exceptional performance in a wide range of applications. With its cutting-edge technology and reliable design, this product offers customers unmatched value and benefits. Whether you're in the automotive industry or working on a high-speed project, this versatile microcontroller is sure to meet your needs with its impressive features and advantages. Trust Texas Instruments for superior quality and choose the MSC1214Y3PAGRG4 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options for the product.

Address Bus Width: 16

Wider address bus width allows for larger memory addressing capabilities, enabling more complex operations.

Package Shape: SQUARE

Square package shape facilitates easy placement on PCBs and efficient use of space.

Bit Size: 8

8-bit architecture offers a good balance between computational power and cost-effectiveness for general-purpose microcontroller applications.

DAC Channels: YES

Integrated DAC channels allow for analog output capabilities, expanding the range of possible applications for the product.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows for compatibility with a wide range of external components and systems.

No. of Terminals: 64

Ample number of terminals provide flexibility for connecting peripherals and external components to the microcontroller.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Flatpack design with thin profile and fine pitch enhances mounting options and allows for high-density PCB layouts.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures operational stability even under fluctuating power conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions.

CPU Family: 8051

8051 CPU family is well-established and widely supported, offering a proven architecture for reliable performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

ADC Channels: YES

Built-in ADC channels enable analog input processing, expanding the range of sensor applications that can be supported.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection to the PCB, enhancing reliability in operation.

ROM Words: 8192

Large ROM capacity provides ample storage for program code, enabling complex applications to be easily implemented.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact packaging and slim design profiles, ideal for space-constrained applications.

Width: 10 mm

Compact width dimension enables efficient PCB layout and board space utilization.

External Data Bus Width: 8

8-bit external data bus width is ideal for interfacing with peripherals and external memory devices in many applications.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency ensures fast processing speeds for time-critical applications.

Length: 10 mm

Compact length dimension contributes to overall space-saving design and ease of integration into compact systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable operation in automotive environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller design provides integrated processing and I/O capabilities, simplifying system design and reducing component count.

RAM Bytes: 1280

Large RAM capacity allows for efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall energy efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical stability, ensuring long-term reliability in operation.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage simplifies power supply design and compatibility with existing systems.

PWM Channels: YES

Integrated PWM channels enable precise control of output signals, making the product suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexibility in programming, enhancing product adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density PCB layout options and allows for compact designs with efficient use of space.

Speed: 40 rpm

High operational speed of 40 rpm enables fast data processing and response times, suitable for real-time control applications.

No. of I/O Lines: 32

Ample number of I/O lines allow for versatile interfacing with external devices and peripherals, enabling flexible system configurations.

Technical Specifications

Microcontrollers MSC1214Y3PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1214Y3PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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