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MSC1214Y3PAGR

Texas Instruments

MSC1214Y3PAGR by Texas Instruments

The Texas Instruments MSC1214Y3PAGR is an 8051 microcontroller with 8-bit processing, 16-bit address bus, and max clock frequency of 40 MHz. Ideal for automotive applications, it features DAC and ADC channels, PWM support, and operates in a temperature range from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,924 parts In-Stock

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7,924

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Digiode

USA . 1,774 parts In-Stock

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1,774

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Distributors (Availability)

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AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$13.351

100+ parts

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554

$13.351

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Parana Technologies

USA . 1,598 parts In-Stock

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$17.106

100+ parts

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$17.320

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1,598

$17.106

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$17.320

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$18.836

100+ parts

$17.329

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156

$18.836

$17.329

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ChromeModa Solutions

Germany . 4,439 parts In-Stock

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$19.220

100+ parts

$15.760

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4,439

$19.220

$15.760

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$19.220

100+ parts

$18.259

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$17.298

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636

$19.220

$18.259

$17.298

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One Stop Electronics

USA . 204 parts In-Stock

1+ parts

$20.000

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204

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Corphita

USA . 4,735 parts In-Stock

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4,735

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Microchip USA

USA . 390 parts In-Stock

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Overview

Elevate your electronic designs with the MSC1214Y3PAGR microcontroller from Texas Instruments. Crafted with precision and expertise, Texas Instruments guarantees top-notch quality in every product. This versatile microcontroller is perfect for a wide range of applications, offering unrivaled performance and reliability. With advanced features like DAC and ADC channels, along with 32 I/O lines and PWM channels, this microcontroller provides endless possibilities for your projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to integrate onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility in power supply options and allows for efficient operation of the microcontroller.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient memory addressing and data transfer within the microcontroller.

Bit Size: 8

An 8-bit architecture provides a good balance between performance and cost for a wide range of embedded system applications.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to output analog signals, enabling it to interface with various sensors and actuators.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) provides flexibility in design and compatibility with different components.

No. of Terminals: 64

With 64 terminals, the microcontroller can easily connect to external devices and peripherals, expanding its functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style allows for compact and space-efficient PCB layout, ideal for miniaturized designs.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage ensures reliable operation even in situations where the power supply may fluctuate or drop slightly.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the microcontroller can withstand harsh environmental conditions without compromising performance.

CPU Family: 8051

The 8051 CPU family is well-established and widely used, offering a proven architecture for stable and reliable operation in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microcontroller to function in cold environments without risk of damage or failure.

ADC Channels: YES

The availability of ADC channels enables the microcontroller to accurately sample and convert analog signals, making it versatile for sensor interfacing.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and component placement, enhancing the overall ease of design and assembly.

ROM Words: 8192

A large ROM size of 8192 words allows for ample program storage capacity, accommodating complex firmware and software requirements.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm enables the microcontroller to be used in slim and space-constrained applications.

Width: 10 mm

The compact width of 10mm facilitates efficient PCB layout and integration into small form factor devices.

External Data Bus Width: 8

An external data bus width of 8 bits allows for fast and efficient data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz ensures rapid execution of instructions and overall responsive performance.

Length: 10 mm

The short length of 10mm contributes to the compact footprint of the microcontroller, making it suitable for space-constrained designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive applications, where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip, reducing external component count and complexity.

RAM Bytes: 1280

With 1280 bytes of RAM, the microcontroller can efficiently store and process data during runtime, enabling complex tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and facilitates automated assembly processes, ensuring robust and reliable electrical connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a common voltage level for compatibility with a wide range of components and peripherals.

PWM Channels: YES

PWM channels enable the microcontroller to generate pulse-width modulated signals, essential for motor control, power regulation, and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enabling efficient development and maintenance of embedded applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting on PCBs, maximizing component placement efficiency and saving space.

Speed: 40 rpm

With a speed of 40 RPM, the microcontroller can handle tasks quickly and efficiently, meeting the performance requirements of various applications.

No. of I/O Lines: 32

Having 32 I/O lines provides ample connectivity options for interfacing with external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers MSC1214Y3PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1214Y3PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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