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MSC1213Y5PAGTG4

Texas Instruments

MSC1213Y5PAGTG4 by Texas Instruments

The Texas Instruments MSC1213Y5PAGTG4 is an 8051 microcontroller with 8-bit processing, featuring a max clock frequency of 40 MHz. It offers 2-Ch 16-Bit DAC and 8-Ch 24-Bit ADC channels for precise analog-to-digital conversion. Ideal for automotive applications due to its wide temperature range (-40 to 125 °C) and connectivity options like I2C, SPI, and USART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,879 parts In-Stock

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Digiode

USA . 2,530 parts In-Stock

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2,530

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One Stop Electronics

USA . 1,171 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 838 parts In-Stock

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$18.615

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838

$18.615

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Parana Technologies

USA . 418 parts In-Stock

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$74.794

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418

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DigiPath Technology Company

USA . 667 parts In-Stock

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$82.357

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$75.769

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667

$82.357

$75.769

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ChromeModa Solutions

Germany . 2,791 parts In-Stock

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$84.038

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$68.911

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2,791

$84.038

$68.911

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$84.038

100+ parts

$79.836

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$75.634

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1,026

$84.038

$79.836

$75.634

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QUARKTWIN TECHNOLOGY LTD

USA . 16,581 parts In-Stock

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Microchip USA

USA . 3,451 parts In-Stock

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Corphita

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the MSC1213Y5PAGTG4 microcontroller. This versatile device, part of the innovative 8051 CPU family, offers a wide range of applications in automotive and industrial settings. With features like dual DAC and ADC channels, 160-word RAM, and 64K data EEPROM size, this microcontroller provides exceptional value and performance. Whether you need precision control or efficient power management, the MSC1213Y5PAGTG4 delivers cutting-edge technology to meet your needs. Choose Texas Instruments for superior quality and unmatched expertise in microcontroller development.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontroller packages for its durability and cost-effectiveness.

Maximum Supply Voltage: 5.25 V

Allows for a higher voltage input which can be beneficial in certain applications.

ADC Channels: Yes

Analog to Digital Converters are useful for converting real-world signals into digital data, expanding the functionality of the microcontroller.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program instructions and data.

Maximum Clock Frequency: 40 MHz

Higher clock frequency provides faster processing capabilities and better performance.

Peripheral IC Type: MICROCONTROLLER

Being specifically designed as a microcontroller ensures optimized performance and functionality for embedded system applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, ideal for energy-efficient applications.

Connectivity: I2C, SPI, USART

Support for multiple communication protocols enhances the versatility and compatibility of the microcontroller in various system designs.

Technical Specifications

Microcontrollers MSC1213Y5PAGTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

13

No. of Terminals:

64

No. of Timers:

4

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

RAM Words:

160

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

"I2C, SPI, USART"

Peripherals:

"BOR, PWM, TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 24-Bit

Digital To Analog Convertors:

2-Ch 16-Bit

Trade Compliance

MSC1213Y5PAGTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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