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MSC1213Y5PAGR

Texas Instruments

MSC1213Y5PAGR by Texas Instruments

The Texas Instruments MSC1213Y5PAGR is an 8051 microcontroller with 8-bit processing, 16-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications, it features DAC and ADC channels, FLASH ROM programmability, and operates in a temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,137 parts In-Stock

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7,137

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Digiode

USA . 2,366 parts In-Stock

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2,366

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Distributors (Availability)

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AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$14.531

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795

$14.531

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One Stop Electronics

USA . 561 parts In-Stock

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$22.000

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561

$22.000

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Parana Technologies

USA . 1,037 parts In-Stock

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$37.658

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$37.658

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DigiPath Technology Company

USA . 1,429 parts In-Stock

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$41.466

100+ parts

$38.148

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1,429

$41.466

$38.148

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ChromeModa Solutions

Germany . 2,288 parts In-Stock

1+ parts

$42.312

100+ parts

$34.696

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2,288

$42.312

$34.696

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

1+ parts

$42.312

100+ parts

$40.196

1k+ parts

$38.081

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1,437

$42.312

$40.196

$38.081

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Corphita

USA . 4,494 parts In-Stock

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Microchip USA

USA . 486 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSC1213Y5PAGR Microcontroller. Designed with precision and reliability in mind, this cutting-edge device offers a wide range of applications while providing unparalleled value to customers. With advanced features like DAC channels, ADC channels, and PWM channels, this microcontroller is perfect for automotive and industrial projects that demand high performance and efficiency. Trust Texas Instruments to deliver quality products that exceed expectations and drive success. Level up your projects today with the MSC1213Y5PAGR Microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

Ability to handle a maximum supply voltage of 5.25V provides a wide operating range for different power supply configurations.

Address Bus Width: 16

With a wide address bus width of 16, the microcontroller can access a larger memory space, enabling complex applications.

Package Shape: SQUARE

Square package shape offers uniformity and ease of handling during manufacturing and assembly processes.

Bit Size: 8

8-bit architecture allows for efficient processing of data and instructions, suitable for a wide range of applications.

DAC Channels: YES

Having DAC channels enables the microcontroller to generate analog output signals, expanding its functionality for various applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 64

A higher number of terminals provide more connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Flatpack style with thin profile and fine pitch design enhances space-saving and facilitates high-density circuit board layouts.

Minimum Supply Voltage: 4.75 V

The ability to operate at a minimum supply voltage of 4.75V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125°C makes the microcontroller suitable for industrial and automotive applications where high temperatures are common.

CPU Family: 8051

Belonging to the 8051 CPU family ensures compatibility and reliability as a proven and widely used microcontroller architecture.

Minimum Operating Temperature: -40 °C

Capability to function at -40°C ensures reliable operation in extreme cold environments, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers good conductivity and corrosion resistance, ensuring long-term reliability in various operating conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, expanding its capability for sensor interfacing and measurement applications.

Terminal Position: QUAD

Quad terminal position provides stability and robustness in PCB mounting, ensuring secure connection and reliability in operation.

ROM Words: 32768

With a ROM size of 32768 words, the microcontroller can store a large amount of program code and data, enabling complex software applications.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm enables compact designs and thin-profile applications, suitable for space-constrained environments.

Width: 10 mm

Compact width of 10mm provides flexibility in board layout and space-saving options, ideal for miniaturized electronic devices.

External Data Bus Width: 8

8-bit external data bus width allows for efficient data transfer between the microcontroller and external memory or devices, improving system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40MHz enables fast processing and execution of instructions, suitable for real-time applications and high-speed control systems.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly processes, maintaining component integrity.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for proper soldering and thermal management during assembly, ensuring component reliability and longevity.

Length: 10 mm

Compact length of 10mm provides a small footprint for the microcontroller, enabling integration into space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable operation in harsh environments such as automotive applications, making it suitable for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller type enables integration of various peripherals and functions on a single chip, simplifying system design and reducing component count.

RAM Bytes: 1280

With 1280 bytes of RAM, the microcontroller can store and manipulate data efficiently, enabling multitasking and data processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and robustness during soldering and PCB mounting, ensuring reliable electrical connections.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V offers compatibility with standard power sources and ensures stable operation in various electronic systems.

PWM Channels: YES

Presence of PWM channels allows the microcontroller to generate pulse-width modulated signals, essential for motor control and power regulation applications.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility for updating firmware and program code, enhancing the adaptability and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB designs and precise soldering, facilitating miniaturization and space-saving on the board.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates the microcontroller's resistance to moisture-induced damage during handling and storage, ensuring reliability in humid environments.

Speed: 40 rpm

Operating speed of 40 rpm enables fast processing and response times for control and communication applications, ensuring efficient system performance.

No. of I/O Lines: 32

32 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility in system integration.

Technical Specifications

Microcontrollers MSC1213Y5PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1213Y5PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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