Loading...

MSC1213Y3PAGRG4

Texas Instruments

MSC1213Y3PAGRG4 by Texas Instruments

The Texas Instruments MSC1213Y3PAGRG4 microcontroller features 8-bit CPU, 16-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications with ADC/DAC channels, ROM words of 8192, and operating temperature range from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,128

-

-

-

-

Digiode

USA . 4,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,007

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,234 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,234

$10.000

-

-

-

AZTECH Wire

Italy . 297 parts In-Stock

1+ parts

$15.200

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$15.200

-

-

-

Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

$49.302

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$49.302

-

-

-

DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$54.287

100+ parts

$49.944

1k+ parts

-

10k+ parts

-

721

$54.287

$49.944

-

-

ChromeModa Solutions

Germany . 4,139 parts In-Stock

1+ parts

$55.395

100+ parts

$45.424

1k+ parts

-

10k+ parts

-

4,139

$55.395

$45.424

-

-

IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$55.395

100+ parts

$52.625

1k+ parts

$49.856

10k+ parts

-

479

$55.395

$52.625

$49.856

-

Corphita

USA . 4,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,773

-

-

-

-

Microchip USA

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

435

-

-

-

-

Overview

Experience the next level of innovation with the MSC1213Y3PAGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller offers a wide range of applications, providing customers with versatility and flexibility in their projects. With its advanced features and cutting-edge technology, the MSC1213Y3PAGRG4 delivers unmatched value, benefits, and advantages to users. Trust Texas Instruments to bring you the best in microcontroller technology for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the microcontroller lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V provides flexibility in power supply options and allows for compatibility with a wide range of systems.

Address Bus Width: 16

The 16-bit address bus width allows for a larger address space, enabling the microcontroller to access a greater amount of memory and peripherals.

Package Shape: SQUARE

The square package shape provides efficient use of PCB space and allows for easy placement on the board, optimizing the design layout.

Bit Size: 8

The 8-bit architecture offers a good balance between performance and cost, making this microcontroller suitable for a wide range of applications.

DAC Channels: YES

The presence of DAC channels allows for analog output generation, making this microcontroller suitable for applications that require precise analog control.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies offers versatility in design and compatibility with different voltage requirements of various applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style ensures efficient use of PCB real estate, enabling compact and high-density designs.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V allows for operation in low-power scenarios and ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microcontroller is suitable for high-temperature environments, such as automotive applications.

CPU Family: 8051

The 8051 CPU family is well-established and widely used, offering a proven and reliable architecture for embedded system development.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40°C to 125°C ensures reliable performance in extreme temperature conditions, making it suitable for harsh environments.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with a wide range of analog sensors and devices.

Terminal Position: QUAD

The quad terminal position ensures easy and secure mounting on the PCB, enhancing reliability and robustness in the system design.

ROM Words: 8192

The 8192 ROM words offer ample memory capacity for storing program code and data, making this microcontroller suitable for complex applications.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for slim and compact PCB designs, ideal for space-constrained applications.

Width: 10 mm

The compact width of 10 mm enables efficient use of PCB space and facilitates integration into small form factor devices.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data transfer between the microcontroller and external memory or devices, enhancing system performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz provides fast processing speed, making the microcontroller suitable for real-time and high-performance applications.

Length: 10 mm

The compact length of 10 mm facilitates space-efficient PCB layout and enables the microcontroller to be incorporated into small and portable devices.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature specification ensures reliable operation in automotive applications where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and I/O functions on a single chip, offering a cost-effective and space-saving solution for embedded systems.

RAM Bytes: 1280

With 1280 bytes of RAM, this microcontroller provides sufficient memory for data storage and temporary program variables, enabling efficient multitasking and data processing.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure solder connections and reliable electrical contact, enhancing the durability and robustness of the PCB assembly.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a stable power source for the microcontroller, ensuring reliable and consistent operation under normal operating conditions.

PWM Channels: YES

The presence of PWM channels allows for precision control of pulse-width modulated signals, making this microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

The use of flash ROM allows for convenient and flexible programming of the microcontroller, enabling easy updates and modifications to the firmware without the need for external programming tools.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on the PCB, allowing for compact and space-efficient designs.

Speed: 40 rpm

With a speed rating of 40 rpm, this microcontroller offers fast processing capabilities, suitable for applications that require real-time data processing and response.

No. of I/O Lines: 32

The 32 I/O lines provide ample connectivity options for interfacing with external devices, sensors, and actuators, making this microcontroller versatile and adaptable to a wide range of applications.

Technical Specifications

Microcontrollers MSC1213Y3PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1213Y3PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20