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MSC1212Y5PAGR

Texas Instruments

MSC1212Y5PAGR by Texas Instruments

The Texas Instruments MSC1212Y5PAGR microcontroller features 16-bit address bus, 8-bit bit size, and 40 MHz max clock frequency. Ideal for automotive applications, it offers DAC and ADC channels, with a temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,136 parts In-Stock

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9,136

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Digiode

USA . 584 parts In-Stock

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584

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Distributors (Availability)

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One Stop Electronics

USA . 879 parts In-Stock

1+ parts

$5.000

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879

$5.000

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AZTECH Wire

Italy . 840 parts In-Stock

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$18.184

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840

$18.184

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Parana Technologies

USA . 2,161 parts In-Stock

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$74.198

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2,161

$74.198

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ChromeModa Solutions

Germany . 3,444 parts In-Stock

1+ parts

$83.369

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$68.363

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3,444

$83.369

$68.363

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IDEA Electronic Components Group

UK . 898 parts In-Stock

1+ parts

$83.369

100+ parts

$79.201

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$75.032

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898

$83.369

$79.201

$75.032

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Corphita

USA . 3,354 parts In-Stock

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3,354

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DigiPath Technology Company

USA . 1,459 parts In-Stock

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$75.165

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Microchip USA

USA . 176 parts In-Stock

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Overview

Unlock the potential of your next project with the MSC1212Y5PAGR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality microcontrollers that are perfect for a wide range of applications. From automotive to industrial, this versatile device offers exceptional value and benefits to customers looking for reliable performance, innovative features, and cutting-edge technology. Upgrade your design with the MSC1212Y5PAGR and experience the advantages of working with a trusted brand like Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the microcontroller lightweight and durable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a PCB.

Maximum Supply Voltage: 5.25 V

Supports a high maximum supply voltage for versatility in different power supply configurations.

Address Bus Width: 16

Wide address bus width allows for efficient memory addressing and data retrieval.

Package Shape: SQUARE

Square package shape ensures easy integration and space-saving on circuit boards.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many embedded applications.

DAC Channels: YES

Integrated DAC channels provide analog output capabilities for various control and interface requirements.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies for compatibility with different voltage standards.

No. of Terminals: 64

A high number of terminals allow for large I/O connectivity and peripheral interfacing options.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The package style offers a compact and low-profile design for space-constrained applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures operation in a wide range of voltage conditions.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the microcontroller suitable for harsh environments and automotive applications.

CPU Family: 8051

8051 CPU family is well-established and widely supported, offering reliability and compatibility with existing designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in cold environments or outdoor applications.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections for reliable operation.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program code and data.

Maximum Seated Height: 1.2 mm

Low maximum seated height facilitates compact PCB designs and reduces overall system size.

Width: 10 mm

Narrow width dimension helps in space-saving and fitting the microcontroller in tight spaces.

External Data Bus Width: 8

8-bit external data bus width enables efficient data transfer between the microcontroller and external components.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast execution of instructions and real-time data processing.

Length: 10 mm

Short length dimension aids in compact system designs and efficient layout on PCBs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications subject to wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller peripheral IC type, it offers integrated CPU, memory, and I/O capabilities for standalone operation.

RAM Bytes: 1280

Ample RAM capacity for temporary data storage and program execution, enabling versatile application use cases.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and surface-mounting capabilities for robust connections.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage simplifies power supply design and compatibility with other components.

PWM Channels: YES

Integrated PWM channels offer precise control over analog signals for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware and application code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact layout and high-density integration on PCBs, optimizing board space usage.

Speed: 40 rpm

High speed capability supports rapid data processing and real-time control applications for improved system performance.

No. of I/O Lines: 32

A significant number of I/O lines offer versatile connectivity options for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers MSC1212Y5PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1212Y5PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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