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MSC1212Y4PAGRG4

Texas Instruments

MSC1212Y4PAGRG4 by Texas Instruments

The Texas Instruments MSC1212Y4PAGRG4 is an 8051 microcontroller with 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. It is used in automotive applications for its FLASH ROM programmability, DAC and ADC channels, and 32 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,788 parts In-Stock

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Digiode

USA . 1,698 parts In-Stock

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1,698

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Distributors (Availability)

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AZTECH Wire

Italy . 601 parts In-Stock

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$13.960

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601

$13.960

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Parana Technologies

USA . 1,092 parts In-Stock

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$16.127

100+ parts

$1,497.618

1k+ parts

$14.514

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1,092

$16.127

$1,497.618

$14.514

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DigiPath Technology Company

USA . 818 parts In-Stock

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$17.758

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$16.337

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818

$17.758

$16.337

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ChromeModa Solutions

Germany . 3,263 parts In-Stock

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$18.120

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$14.858

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3,263

$18.120

$14.858

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

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$18.120

100+ parts

$17.214

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$16.308

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1,307

$18.120

$17.214

$16.308

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One Stop Electronics

USA . 170 parts In-Stock

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$25.000

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170

$25.000

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Corphita

USA . 3,085 parts In-Stock

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Microchip USA

USA . 183 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSC1212Y4PAGRG4 microcontroller. Designed with precision and quality in mind, this versatile device offers a wide range of applications for your projects. From automotive to industrial settings, this microcontroller provides unparalleled performance and functionality. With its advanced features and robust design, the Texas Instruments MSC1212Y4PAGRG4 ensures that you have the tools you need to bring your ideas to life. Experience the value and benefits that this product brings to the table, and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product while keeping it lightweight.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power supply options.

Address Bus Width: 16

Supports a larger memory addressing capability.

Package Shape: SQUARE

Compact design for efficient use of space.

Bit Size: 8

Suitable for handling smaller data processing tasks efficiently.

DAC Channels: YES

Allows for analog output capabilities.

Power Supplies (V): 3/5

Versatile power supply options for different applications.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Enhances the product's overall performance and reliability.

Minimum Supply Voltage: 4.75 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 125 °C

Suitable for applications that require high temperature tolerance.

CPU Family: 8051

Well-established and widely supported microcontroller family.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments with low temperatures.

ADC Channels: YES

Provides analog input capabilities for a wider range of applications.

Terminal Position: QUAD

Efficient terminal layout for easy installation and connectivity.

ROM Words: 16384

Offers ample space for program storage.

Maximum Seated Height: 1.2 mm

Low profile design for compact system integration.

Width: 10 mm

Compact form factor suitable for space-constrained applications.

External Data Bus Width: 8

Efficient data transfer capabilities.

Maximum Clock Frequency: 40 MHz

High processing speed for quick and responsive performance.

Length: 10 mm

Compact size for versatile mounting options.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications.

RAM Bytes: 1280

Adequate memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Allows for easy soldering and reliable connections.

Nominal Supply Voltage: 5 V

Standard voltage compatibility for various applications.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of outputs.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM.

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting and wiring.

Speed: 40 rpm

Quick processing speed for efficient performance.

No. of I/O Lines: 32

Sufficient input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers MSC1212Y4PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1212Y4PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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