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MSC1212Y3PAGRG4

Texas Instruments

MSC1212Y3PAGRG4 by Texas Instruments

The Texas Instruments MSC1212Y3PAGRG4 microcontroller features 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. Ideal for automotive applications, it offers DAC and ADC channels, with a max supply voltage of 5.25 V. This CMOS technology-based microcontroller is designed for high-speed processing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

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7,860

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Digiode

USA . 1,452 parts In-Stock

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1,452

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Distributors (Availability)

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One Stop Electronics

USA . 358 parts In-Stock

1+ parts

$3.000

100+ parts

-

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358

$3.000

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$9.934

100+ parts

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250

$9.934

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Parana Technologies

USA . 14 parts In-Stock

1+ parts

$43.541

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14

$43.541

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ChromeModa Solutions

Germany . 5,540 parts In-Stock

1+ parts

$48.922

100+ parts

$40.116

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5,540

$48.922

$40.116

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$48.922

100+ parts

$46.476

1k+ parts

$44.030

10k+ parts

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1,952

$48.922

$46.476

$44.030

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Corphita

USA . 3,701 parts In-Stock

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3,701

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DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

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$44.108

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2,273

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$44.108

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Microchip USA

USA . 155 parts In-Stock

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155

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Overview

Unlock endless possibilities with the MSC1212Y3PAGRG4 by Texas Instruments, a cutting-edge microcontroller designed to revolutionize your projects. Crafted with precision and expertise by one of the most trusted manufacturers in the industry, this microcontroller offers unparalleled performance and reliability. From automotive to industrial applications, this versatile device delivers exceptional value, efficiency, and flexibility to meet all your needs. Experience innovation at its finest with the MSC1212Y3PAGRG4 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, streamlining the manufacturing process.

Maximum Supply Voltage: 5.25 V

Support for a higher supply voltage allows for flexibility in power input and compatibility with a variety of systems.

Address Bus Width: 16

A wider address bus width enables the microcontroller to access a larger memory space, enhancing its processing capabilities.

Bit Size: 8

8-bit architecture provides a good balance between cost and performance, suitable for many general-purpose applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog sensors and devices, expanding its range of applications.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for flexibility in system design and power management.

No. of Terminals: 64

A higher number of terminals provide more connectivity options and versatility in interfacing with other components.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style enhance space efficiency and simplifies PCB layout, crucial for compact designs.

Minimum Supply Voltage: 4.75 V

Support for a lower minimum supply voltage ensures reliable operation even when power sources are limited or fluctuating.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance makes the microcontroller suitable for use in automotive and industrial applications where temperature variations are common.

CPU Family: 8051

Part of the widely-used 8051 family of microcontrollers, providing a proven and reliable architecture with extensive support and resources.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to accurately read and process analog signals, crucial for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position provides a stable and secure mounting option, ensuring proper connectivity and reliability in operation.

ROM Words: 8192

Large ROM capacity allows for storing program instructions and data, enabling sophisticated applications and functions to be executed.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables compact device designs and efficient use of space in tight layouts.

Width: 10 mm

Compact width dimension allows for easy integration into small form factor devices or PCB layouts with space constraints.

External Data Bus Width: 8

8-bit external data bus width ensures efficient data transfer and processing, suitable for a wide range of applications requiring moderate throughput.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency provides fast processing speed and responsiveness, enhancing overall performance and real-time capabilities.

Length: 10 mm

Compact length dimension enables versatile placement options and efficient use of space in device designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in harsh environments and automotive applications where temperature extremes are common.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, providing dedicated processing capabilities and features tailored for embedded control applications.

RAM Bytes: 1280

Generous RAM capacity allows for efficient data storage and manipulation during program execution, facilitating complex computations and data processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices and systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring robust electrical connections and long-term durability.

Nominal Supply Voltage: 5 V

Stable and common nominal supply voltage simplifies power supply design and compatibility with standard voltage sources.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals and motor speed, essential for applications requiring variable speed control.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient reprogramming of the microcontroller, enabling quick updates and modifications to firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density connectivity options while maintaining reliable electrical connections, crucial for compact PCB designs.

Speed: 40 rpm

High-speed processing capability at 40 MHz enables quick response times and efficient execution of program instructions, ideal for real-time applications.

No. of I/O Lines: 32

Adequate number of I/O lines provide versatile input/output options for interfacing with external devices and sensors, enhancing the microcontroller's functionality and connectivity.

Technical Specifications

Microcontrollers MSC1212Y3PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1212Y3PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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