Loading...

MSC1212Y3PAGR

Texas Instruments

MSC1212Y3PAGR by Texas Instruments

The Texas Instruments MSC1212Y3PAGR is a microcontroller with 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. Ideal for automotive applications, it features DAC and ADC channels, 1280 bytes of RAM, and operates b/w -40 to 125 °C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,907

-

-

-

-

Digiode

USA . 2,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,517

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 673 parts In-Stock

1+ parts

$12.787

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$12.787

-

-

-

One Stop Electronics

USA . 1,352 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,352

$25.000

-

-

-

Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$39.749

100+ parts

$3,691.314

1k+ parts

$35.774

10k+ parts

-

1,703

$39.749

$3,691.314

$35.774

-

DigiPath Technology Company

USA . 321 parts In-Stock

1+ parts

$43.769

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$43.769

-

-

-

ChromeModa Solutions

Germany . 4,164 parts In-Stock

1+ parts

$44.662

100+ parts

$36.623

1k+ parts

-

10k+ parts

-

4,164

$44.662

$36.623

-

-

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$44.662

100+ parts

$42.429

1k+ parts

$40.196

10k+ parts

-

1,094

$44.662

$42.429

$40.196

-

Component Stockers USA

USA . 276 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$99.990

-

-

-

Corphita

USA . 3,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,192

-

-

-

-

Microchip USA

USA . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

458

-

-

-

-

Overview

Experience the innovative technology of Texas Instruments with the MSC1212Y3PAGR microcontroller. Designed with precision and quality in mind, this microcontroller offers unparalleled performance for a variety of applications. Whether you're working on automotive projects or industrial automation, this microcontroller delivers exceptional value and benefits to customers. With features like DAC and ADC channels, along with a high clock frequency, the MSC1212Y3PAGR is the perfect choice for your next project. Trust Texas Instruments for reliable and cutting-edge microcontroller solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability of the microcontroller.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Provides flexibility in power supply options and ensures stable operation within the specified range.

Address Bus Width: 16

Allows for efficient memory addressing and data transfer capabilities.

Bit Size: 8

Suitable for handling a wide range of basic computing tasks efficiently.

DAC Channels: YES

Enables analog output capability, useful for various applications such as audio processing or sensor interfacing.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external devices and peripherals.

Maximum Operating Temperature: 125 °C

Can operate reliably in harsh environmental conditions, making it suitable for automotive applications.

CPU Family: 8051

Well-established and widely used processor architecture with a robust ecosystem for development and support.

ADC Channels: YES

Enables analog input capabilities, essential for reading sensor data and other analog signals.

ROM Words: 8192

Provides sufficient non-volatile memory for storing program code and data.

Peripheral IC Type: MICROCONTROLLER

Offers integrated peripherals and processing capabilities in a single chip, reducing the need for external components.

RAM Bytes: 1280

Adequate random access memory for storing and manipulating data during program execution.

Technical Specifications

Microcontrollers MSC1212Y3PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1212Y3PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20