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MSC1211Y4PAGRG4

Texas Instruments

MSC1211Y4PAGRG4 by Texas Instruments

The Texas Instruments MSC1211Y4PAGRG4 microcontroller features 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. Ideal for automotive applications, it offers DAC and ADC channels, with a temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,397 parts In-Stock

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3,397

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Digiode

USA . 2,809 parts In-Stock

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2,809

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Distributors (Availability)

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AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$10.086

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510

$10.086

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One Stop Electronics

USA . 786 parts In-Stock

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$26.000

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786

$26.000

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Parana Technologies

USA . 2,353 parts In-Stock

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$47.735

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$47.735

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DigiPath Technology Company

USA . 1,628 parts In-Stock

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$52.562

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$48.357

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1,628

$52.562

$48.357

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ChromeModa Solutions

Germany . 5,558 parts In-Stock

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$53.635

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$43.981

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5,558

$53.635

$43.981

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IDEA Electronic Components Group

UK . 2,055 parts In-Stock

1+ parts

$53.635

100+ parts

$50.953

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$48.272

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2,055

$53.635

$50.953

$48.272

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QUARKTWIN TECHNOLOGY LTD

USA . 22,687 parts In-Stock

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Corphita

USA . 2,402 parts In-Stock

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Microchip USA

USA . 279 parts In-Stock

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Overview

Unlock the power of innovation with the MSC1211Y4PAGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is versatile and can be applied in various applications, offering customers unparalleled value and benefits. With advanced features like DAC and PWM channels, along with a wide operating temperature range, this product provides optimal performance for any project. Experience the advantages of Texas Instruments technology with the MSC1211Y4PAGRG4 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or handheld devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, providing flexibility in application design.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and devices, expanding its range of applications.

ROM Words: 16384

The large ROM capacity allows for extensive program storage, enabling the microcontroller to support complex algorithms and functions.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency ensures efficient processing speeds, making the microcontroller suitable for applications requiring quick response times.

RAM Bytes: 1280

The ample RAM capacity allows for temporary data storage and efficient multitasking, enhancing the overall performance of the microcontroller.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers MSC1211Y4PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1211Y4PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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