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MSC1211Y3PAGRG4

Texas Instruments

MSC1211Y3PAGRG4 by Texas Instruments

The Texas Instruments MSC1211Y3PAGRG4 microcontroller features 16-bit address bus, 8-bit bit size, and 40 MHz clock frequency. Ideal for automotive applications, it offers DAC and ADC channels, with a temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,829 parts In-Stock

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Digiode

USA . 1,257 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 603 parts In-Stock

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$15.660

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603

$15.660

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Parana Technologies

USA . 461 parts In-Stock

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$24.590

100+ parts

$2,283.537

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$22.131

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461

$24.590

$2,283.537

$22.131

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One Stop Electronics

USA . 1,462 parts In-Stock

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$26.000

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$26.000

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DigiPath Technology Company

USA . 1,020 parts In-Stock

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$27.076

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$24.910

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$27.076

$24.910

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ChromeModa Solutions

Germany . 556 parts In-Stock

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$27.629

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$22.656

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556

$27.629

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IDEA Electronic Components Group

UK . 56 parts In-Stock

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$27.629

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$26.248

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$24.866

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56

$27.629

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$24.866

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Component Stockers USA

USA . 201 parts In-Stock

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$99.990

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Corphita

USA . 4,183 parts In-Stock

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Microchip USA

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Overview

Discover the innovative MSC1211Y3PAGRG4 microcontroller by Texas Instruments, a cutting-edge solution that offers unmatched quality and reliability. This versatile device is perfect for a wide range of applications thanks to its advanced features and high-performance capabilities. With Texas Instruments' renowned reputation for excellence, you can trust that this product will exceed your expectations. Experience the value and benefits of the MSC1211Y3PAGRG4 and unlock endless possibilities for your projects. Elevate your designs with this exceptional microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 5.25 V

Offers a wide range of supply voltage flexibility for various applications.

Address Bus Width: 16

Enables the microcontroller to access a large memory space efficiently.

Bit Size: 8

Optimal bit size for processing tasks efficiently.

DAC Channels: YES

Allows the microcontroller to output analog signals accurately.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies.

No. of Terminals: 64

Provides ample connections for interfacing with other devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Enables compact and efficient PCB design.

Minimum Supply Voltage: 4.75 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environments.

CPU Family: 8051

Proven and reliable CPU architecture for embedded systems.

Minimum Operating Temperature: -40 °C

Operates in extreme cold conditions without performance issues.

ADC Channels: YES

Allows the microcontroller to convert analog signals to digital data.

Terminal Position: QUAD

Facilitates easy PCB layout and assembly.

ROM Words: 8192

Sufficient memory for storing program instructions.

Maximum Seated Height: 1.2 mm

Low profile design suitable for space-constrained applications.

Width: 10 mm

Compact size for integration into small devices.

External Data Bus Width: 8

Efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

High clock speed for fast processing of instructions.

Length: 10 mm

Symmetrical dimensions for easy mounting on PCBs.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications that require reliable performance in varying temperatures.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for handling various input/output peripherals in embedded systems.

RAM Bytes: 1280

Sufficient memory for storing and manipulating data during program execution.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Secure and reliable terminal connection for mounting on PCBs.

Nominal Supply Voltage: 5 V

Standard power supply voltage for compatibility with common power sources.

PWM Channels: YES

Enables precise control of analog devices using pulse-width modulation.

ROM Programmability: FLASH

Allows for easy reprogramming of memory contents for flexibility in application development.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB integration.

Speed: 40 rpm

High processing speed for quick response to input signals.

No. of I/O Lines: 32

Sufficient input/output lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSC1211Y3PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1211Y3PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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