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LM3S9D96-IBZ80-A1

Texas Instruments

LM3S9D96-IBZ80-A1 by Texas Instruments

LM3S9D96-IBZ80-A1 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at up to 16.384 MHz clock frequency. It features ADC and DMA channels, suitable for industrial applications requiring a low-profile package with a max seated height of 1.5 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,667 parts In-Stock

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Digiode

USA . 2,524 parts In-Stock

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2,524

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Distributors (Availability)

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One Stop Electronics

USA . 240 parts In-Stock

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$2.000

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240

$2.000

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AZTECH Wire

Italy . 688 parts In-Stock

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$8.346

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688

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Parana Technologies

USA . 770 parts In-Stock

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$59.925

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770

$59.925

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DigiPath Technology Company

USA . 176 parts In-Stock

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$65.985

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$60.707

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176

$65.985

$60.707

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IDEA Electronic Components Group

UK . 616 parts In-Stock

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$67.332

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$63.965

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$60.599

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616

$67.332

$63.965

$60.599

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ChromeModa Solutions

Germany . 390 parts In-Stock

1+ parts

$67.332

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$55.212

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390

$67.332

$55.212

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QUARKTWIN TECHNOLOGY LTD

USA . 21,924 parts In-Stock

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Corphita

USA . 2,525 parts In-Stock

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Microchip USA

USA . 149 parts In-Stock

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149

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Overview

Unlock endless possibilities with the LM3S9D96-IBZ80-A1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality microcontrollers like this one that are perfect for a wide range of applications. Whether you're designing innovative IoT devices, robotics, or industrial automation systems, this product offers unmatched value, benefits, and advantages. With advanced features such as ADC and DMA channels, ROM programmability, and a maximum clock frequency of 16.384 MHz, the possibilities are truly limitless. Choose Texas Instruments and elevate your projects to new heights with the LM3S9D96-IBZ80-A1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power requirements and compatibility with a range of systems.

Package Shape: SQUARE

Square package shape provides a compact form factor and efficient use of space in electronic designs.

Bit Size: 32

32-bit architecture offers improved performance and efficiency compared to lower bit sizes, suitable for handling complex operations.

No. of Terminals: 108

Higher number of terminals allows for more connections and functionalities, enhancing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enables high-density mounting, enhancing circuit board layout and system integration.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the microcontroller can function in extreme cold environments.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels support direct memory access, enhancing data transfer speeds and overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies layout design and offers easy access for soldering and connection in PCB assembly.

Maximum Seated Height: 1.5 mm

Low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.

Width: 10 mm

Narrow width dimension enables efficient placement on the circuit board and conserves space in electronic products.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency provides fast processing capabilities, suitable for demanding real-time applications.

Length: 10 mm

Compact length dimension contributes to overall space-saving design and optimal use of board real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with fluctuating temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller peripheral IC type offers efficiency and high performance for various embedded applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: BALL

Ball terminal form simplifies soldering and improves electrical connections for reliable performance in the microcontroller.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller within specified voltage limits.

PWM Channels: YES

PWM channels enable pulse-width modulation for precise control of digital signals, essential for motor control and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and convenient firmware updates, customization, and storage of program code.

Terminal Pitch: 0.8 mm

Narrow terminal pitch provides high-density mounting options and facilitates compact designs in electronic systems.

Speed: 80 rpm

High-speed performance at 80 rpm offers quick response and efficient execution of tasks in time-critical applications.

No. of I/O Lines: 65

Abundance of I/O lines enables versatile connectivity options and interface capabilities for diverse input and output requirements.

Technical Specifications

Microcontrollers LM3S9D96-IBZ80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9D96-IBZ80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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