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LM3S9D92-IBZ80-A1T

Texas Instruments

LM3S9D92-IBZ80-A1T by Texas Instruments

Texas Instruments' LM3S9D92-IBZ80-A1T microcontroller features 32-bit architecture, 16.384 MHz clock frequency, and 65 I/O lines. Ideal for industrial applications, it offers ADC and DMA channels, with a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,370 parts In-Stock

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3,370

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Vyrian

USA . 2,822 parts In-Stock

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2,822

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Distributors (Availability)

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One Stop Electronics

USA . 1,557 parts In-Stock

1+ parts

$5.000

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1,557

$5.000

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AZTECH Wire

Italy . 734 parts In-Stock

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$19.712

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734

$19.712

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Parana Technologies

USA . 1,013 parts In-Stock

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$22.264

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$22.938

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1,013

$22.264

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$22.938

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$24.516

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$22.554

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1,510

$24.516

$22.554

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ChromeModa Solutions

Germany . 5,177 parts In-Stock

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$25.016

100+ parts

$20.513

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5,177

$25.016

$20.513

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IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$25.016

100+ parts

$23.765

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$22.514

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121

$25.016

$23.765

$22.514

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Corphita

USA . 4,384 parts In-Stock

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4,384

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Microchip USA

USA . 331 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S9D92-IBZ80-A1T by Texas Instruments. As a leader in microcontroller innovation, Texas Instruments delivers top-quality products designed to meet the demands of a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched performance, reliability, and versatility. Take your projects to the next level with the LM3S9D92-IBZ80-A1T and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for applications where weight and impact resistance are important.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, reducing assembly time and cost.

Maximum Supply Voltage: 1.365 V

Operating at a maximum supply voltage of 1.365 V provides efficient power consumption and helps in extending battery life for portable devices.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, especially in applications with limited space available.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, allowing for faster and more complex operations to be handled efficiently.

No. of Terminals: 108

Having a high number of terminals allows for versatile connections and interfaces with other components, making the microcontroller versatile in design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures high electrical performance and reliability, making it suitable for demanding industrial applications.

Minimum Supply Voltage: 1.235 V

With a low minimum supply voltage, the microcontroller can operate efficiently even with limited power sources.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C enables the microcontroller to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capability to operate at as low as -40°C makes the microcontroller suitable for applications in extreme cold environments.

ADC Channels: YES

Integrated ADC channels allow for analog to digital conversion, enabling the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

DMA channels provide efficient data transfer capabilities, offloading the CPU and improving overall system performance.

Terminal Position: BOTTOM

Terminal position at the bottom simplifies PCB layout and allows for easy access during assembly and maintenance.

Maximum Seated Height: 1.5 mm

Low seated height helps in reducing the overall profile of the PCB, making it suitable for compact and slim device designs.

Width: 10 mm

Compact width dimension enables easy placement and routing on the PCB, especially in space-constrained applications.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency allows for fast processing speed, enabling the microcontroller to handle real-time tasks efficiently.

Length: 10 mm

Compact length dimension provides flexibility in PCB layout and design, especially in applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions typically found in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and efficiency, making it suitable for a wide range of embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and allows for simplified soldering during assembly.

Nominal Supply Voltage: 1.3 V

Having a nominal supply voltage of 1.3 V ensures stable and reliable operation under normal operating conditions.

PWM Channels: YES

Integrated PWM channels allow for precise control of digital signals, making the microcontroller suitable for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the firmware or software, providing flexibility and scalability in the system design.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm allows for high-density PCB layouts, enabling more functionalities in a smaller footprint.

Speed: 80 rpm

Operating at a speed of 80 rpm ensures efficient processing and data handling, suitable for a variety of real-time applications.

No. of I/O Lines: 65

Having 65 I/O lines provides ample interfacing options, allowing for versatile connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S9D92-IBZ80-A1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9D92-IBZ80-A1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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