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LM3S9B92-IBZ80-C5

Texas Instruments

LM3S9B92-IBZ80-C5 by Texas Instruments

LM3S9B92-IBZ80-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words, 98304 RAM bytes, and 65 I/O lines. It operates at a max clock frequency of 16.384 MHz and is suitable for industrial applications requiring a high-speed RISC CPU like robotics or automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 7,209 parts In-Stock

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Digiode

USA . 2,797 parts In-Stock

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Chip Stock

USA . 168 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 364 parts In-Stock

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$5.663

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One Stop Electronics

USA . 1,440 parts In-Stock

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$12.000

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Parana Technologies

USA . 510 parts In-Stock

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$32.785

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$112.543

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DigiPath Technology Company

USA . 548 parts In-Stock

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$36.100

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$33.212

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ChromeModa Solutions

Germany . 3,834 parts In-Stock

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$36.837

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$30.206

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

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$36.837

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$34.995

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$33.153

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QUARKTWIN TECHNOLOGY LTD

USA . 18,292 parts In-Stock

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Corphita

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Microchip USA

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Overview

Discover the LM3S9B92-IBZ80-C5 by Texas Instruments, a top-quality microcontroller designed to deliver exceptional performance and reliability. With Texas Instruments' renowned reputation for innovation, this product offers unparalleled value to customers in various applications. Whether you're working on industrial automation, consumer electronics, or automotive systems, this microcontroller provides advanced features like ADC and DMA channels, along with a powerful Cortex-M3 CPU family. Trust Texas Instruments to provide cutting-edge technology that meets your needs for efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Supply Voltage: 1.365 V

Ensures safe and reliable operation within specified voltage limits.

Bit Size: 32

Offers high processing capability for complex tasks and computations.

Power Supplies (V): 1.2,3.3

Provides flexibility in power input options for different applications.

No. of Terminals: 108

Offers ample connections for interfacing with other components and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: CORTEX-M3

The CORTEX-M3 architecture provides efficient processing and performance.

ROM Words: 262144

Provides ample storage for program instructions and data.

PWM Channels: YES

Allows for precise control of analog outputs such as motor speed or LED brightness.

Technical Specifications

Microcontrollers LM3S9B92-IBZ80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B92-IBZ80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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