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LM3S9790-IBZ80-C5

Texas Instruments

LM3S9790-IBZ80-C5 by Texas Instruments

Texas Instruments LM3S9790-IBZ80-C5 is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at up to 16.384 MHz, suitable for industrial applications requiring high-speed processing and features like ADC and DMA channels for efficient data handling. The package style is grid array, low profile, fine pitch making it ideal for compact designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,855 parts In-Stock

1+ parts

-

100+ parts

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9,855

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Digiode

USA . 3,780 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,780

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 873 parts In-Stock

1+ parts

$5.000

100+ parts

-

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873

$5.000

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AZTECH Wire

Italy . 566 parts In-Stock

1+ parts

$15.637

100+ parts

-

1k+ parts

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566

$15.637

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Parana Technologies

USA . 1,388 parts In-Stock

1+ parts

$24.269

100+ parts

-

1k+ parts

$24.925

10k+ parts

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1,388

$24.269

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$24.925

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ChromeModa Solutions

Germany . 3,684 parts In-Stock

1+ parts

$27.269

100+ parts

$22.361

1k+ parts

-

10k+ parts

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3,684

$27.269

$22.361

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$27.269

100+ parts

$25.906

1k+ parts

$24.542

10k+ parts

-

2,100

$27.269

$25.906

$24.542

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Corphita

USA . 1,739 parts In-Stock

1+ parts

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1,739

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DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

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100+ parts

$24.586

1k+ parts

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659

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$24.586

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Microchip USA

USA . 335 parts In-Stock

1+ parts

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100+ parts

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335

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Overview

Unlock endless possibilities with the LM3S9790-IBZ80-C5 by Texas Instruments, a high-quality microcontroller that sets the standard in performance and reliability. Designed for a wide range of applications, this product offers unmatched value with its advanced features and cutting-edge technology. From industrial automation to consumer electronics, this microcontroller delivers superior functionality and efficiency, making it the ideal choice for your next project. Trust Texas Instruments for innovation that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.365 V

Ensures safe operation and protects the microcontroller from overvoltage damage.

Package Shape: SQUARE

Facilitates easier placement and mounting on the PCB.

Bit Size: 32

Allows for processing larger amounts of data efficiently.

Power Supplies (V): 1.2,3.3

Offers flexibility in power options for different applications.

No. of Terminals: 108

Provides a sufficient number of connection points for interfacing with external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and efficient PCB design.

Minimum Supply Voltage: 1.235 V

Allows for efficient operation at lower voltage levels.

Maximum Operating Temperature: 85 °C

Allows for reliable operation in high-temperature environments.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient processor architecture for optimal performance.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extremely low-temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

Enables efficient and high-speed data transfer without CPU intervention.

Terminal Position: BOTTOM

Facilitates easy PCB layout and connection with external components.

ROM Words: 131072

Provides ample memory for program storage and data processing.

Maximum Seated Height: 1.5 mm

Enables low-profile design for space-constrained applications.

Width: 10 mm

Compact size for integration into small form factor devices.

Maximum Clock Frequency: 16.384 MHz

Offers high-speed processing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during PCB assembly.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes.

Length: 10 mm

Compact size for space-efficient PCB design.

Temperature Grade: INDUSTRIAL

Designed for reliable operation in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast data processing.

RAM Bytes: 65536

Provides ample memory for data storage and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high reliability.

Terminal Form: BALL

Allows for reliable and secure solder connections.

Nominal Supply Voltage: 1.3 V

Optimal voltage level for efficient operation.

PWM Channels: YES

Allows for precision control of connected devices.

ROM Programmability: FLASH

Enables easy reprogramming of the microcontroller.

Terminal Pitch: 0.8 mm

Facilitates easy PCB layout for soldering and connections.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with a specific moisture sensitivity level.

Speed: 80 rpm

Operates at high speeds for efficient data processing.

No. of I/O Lines: 60

Provides a sufficient number of input and output lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S9790-IBZ80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9790-IBZ80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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