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LM3S9790-IBZ80-C3

Texas Instruments

LM3S9790-IBZ80-C3 by Texas Instruments

Texas Instruments' LM3S9790-IBZ80-C3 is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and PWM channels, as well as DMA support. With a wide temperature range from -40 to 85 °C, it offers versatile performance in various environments.

Median Price

$10.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$8.440

1k+ parts

$7.550

10k+ parts

$7.100

342

-

$8.440

$7.550

$7.100

DigiKey

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$11.100

1k+ parts

-

10k+ parts

-

342

-

$11.100

-

-

Verical

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$10.550

1k+ parts

$9.438

10k+ parts

$8.875

342

-

$10.550

$9.438

$8.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,648 parts In-Stock

1+ parts

$8.902

100+ parts

-

1k+ parts

-

10k+ parts

-

4,648

$8.902

-

-

-

Vyrian

USA . 9,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,621

-

-

-

-

DigiKey Marketplace

USA . 342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

342

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,805 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

-

10k+ parts

-

2,805

$8.433

-

-

-

Parana Technologies

USA . 2,229 parts In-Stock

1+ parts

$18.110

100+ parts

-

1k+ parts

$18.252

10k+ parts

-

2,229

$18.110

-

$18.252

-

DigiPath Technology Company

USA . 2,368 parts In-Stock

1+ parts

$19.941

100+ parts

$18.346

1k+ parts

-

10k+ parts

-

2,368

$19.941

$18.346

-

-

ChromeModa Solutions

Germany . 2,173 parts In-Stock

1+ parts

$20.348

100+ parts

$16.685

1k+ parts

-

10k+ parts

-

2,173

$20.348

$16.685

-

-

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$20.348

100+ parts

$19.331

1k+ parts

$18.313

10k+ parts

-

217

$20.348

$19.331

$18.313

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,884

-

-

-

-

Microchip USA

USA . 227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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227

-

-

-

-

Overview

Discover the LM3S9790-IBZ80-C3 by Texas Instruments, a top-quality microcontroller designed to meet the demands of industrial applications. With advanced technology and reliable performance, this product offers unmatched value and benefits to customers. Whether you're looking to optimize your automation processes or enhance your embedded systems, this microcontroller is the perfect solution. Trust Texas Instruments for cutting-edge innovation and superior quality in the world of microcontrollers. Elevate your projects with the LM3S9790-IBZ80-C3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options while still maintaining safe operating levels.

Package Shape: SQUARE

Facilitates compact and efficient PCB layout, saving space in electronic designs.

Bit Size: 32

Enables the microcontroller to process data in larger chunks, leading to faster processing speeds and increased performance.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, making it versatile for a variety of applications.

No. of Terminals: 108

Provides ample connection points for interfacing with other components, peripherals, and external devices.

Package Style (Meter): GRID ARRAY

Offers a reliable and robust package style, ensuring secure mounting on the PCB.

Minimum Supply Voltage: 1.08 V

Ensures reliable operation even at lower power supply levels, increasing efficiency and performance.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to operate in high-temperature environments without risk of overheating or malfunction.

Minimum Operating Temperature: -40 °C

Provides a wide operating temperature range, making the microcontroller suitable for use in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Ensures good electrical conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access for optimized data transfer and processing, improving overall system performance.

Terminal Position: BOTTOM

Simplifies PCB layout and assembly, providing easy access to the terminals for connection purposes.

ROM Words: 131072

Offers ample memory capacity for program storage and data retention, accommodating complex algorithms and applications.

Maximum Seated Height: 1.5 mm

Features a low-profile design, suitable for compact and space-constrained electronic devices.

Width: 10 mm

Compact size allows for easy integration into small form factor designs.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed processing capabilities for demanding applications and real-time systems.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands high reflow temperatures during manufacturing processes without compromising functionality.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for secure and reliable solder joints.

Length: 10 mm

Compact size ensures compatibility with a wide range of electronic designs and enclosures.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature and humidity levels.

Peripheral IC Type: MICROCONTROLLER, RISC

Features RISC architecture for efficient and fast data processing, ideal for embedded control applications.

RAM Bytes: 65536

Offers sufficient random-access memory for data storage and manipulation, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall energy efficiency.

Terminal Form: BALL

Ball terminals ensure secure and reliable connections on the PCB, reducing the risk of intermittent contacts.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent and reliable operation, ensuring system reliability.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of motor speeds, LED brightness, and other analog applications.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the ROM, facilitating software updates and improvements.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact PCB design and high-density mounting, maximizing board space utilization.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure during manufacturing and operation.

Speed: 80 rpm

Provides high-speed processing capabilities for real-time control and data manipulation tasks.

No. of I/O Lines: 60

Ample I/O lines for interfacing with external devices, peripherals, and sensors, enhancing system flexibility and connectivity.

Technical Specifications

Microcontrollers LM3S9790-IBZ80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9790-IBZ80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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