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LM3S8970-EQC50-A2T

Texas Instruments

LM3S8970-EQC50-A2T by Texas Instruments

LM3S8970-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. With a package style of FLATPACK and GULL WING terminal form, it offers compact design and efficient connectivity in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,997 parts In-Stock

1+ parts

-

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4,997

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Digiode

USA . 3,006 parts In-Stock

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3,006

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$18.738

100+ parts

-

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569

$18.738

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One Stop Electronics

USA . 1,163 parts In-Stock

1+ parts

$19.000

100+ parts

-

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1,163

$19.000

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Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

$33.291

100+ parts

-

1k+ parts

$121.931

10k+ parts

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1,615

$33.291

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$121.931

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DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

$36.658

100+ parts

$33.725

1k+ parts

-

10k+ parts

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519

$36.658

$33.725

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ChromeModa Solutions

Germany . 3,030 parts In-Stock

1+ parts

$37.406

100+ parts

$30.673

1k+ parts

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10k+ parts

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3,030

$37.406

$30.673

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IDEA Electronic Components Group

UK . 602 parts In-Stock

1+ parts

$37.406

100+ parts

$35.536

1k+ parts

$33.665

10k+ parts

-

602

$37.406

$35.536

$33.665

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Corphita

USA . 2,524 parts In-Stock

1+ parts

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2,524

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Microchip USA

USA . 478 parts In-Stock

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478

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Overview

Experience the cutting-edge technology of the LM3S8970-EQC50-A2T microcontroller by Texas Instruments, a leading manufacturer known for its superior quality and innovation. This versatile device is perfect for a wide range of applications, offering customers unmatched value, benefits, and advantages. With its high-performance capabilities, efficient power supplies, and robust features, this microcontroller is a must-have for anyone looking to take their projects to the next level. Trust Texas Instruments to deliver excellence in every aspect with the LM3S8970-EQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 2.75 V

Operates efficiently at a maximum supply voltage of 2.75 V, reducing energy consumption.

Bit Size: 32

32-bit architecture enables high-performance computing and data processing capabilities.

RAM Bytes: 65536

Large RAM capacity allows for efficient data storage and processing, enhancing overall performance.

ADC Channels: YES

Integrated ADC channels enable accurate analog-to-digital conversion, essential for sensor interfacing and data acquisition.

ROM Words: 262144

Flash ROM with 262144 words provides ample storage for program code and data, allowing for versatility in application development.

Maximum Operating Temperature: 105 °C

Withstanding high temperatures up to 105°C ensures reliable operation in industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions down to -40°C, suitable for a wide range of environmental conditions.

Maximum Clock Frequency: 8.192 MHz

High clock frequency of 8.192 MHz enables fast execution of instructions and real-time processing capabilities.

Technical Specifications

Microcontrollers LM3S8970-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8970-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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