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LM3S8930-IQC50-A2

Texas Instruments

LM3S8930-IQC50-A2 by Texas Instruments

Texas Instruments LM3S8930-IQC50-A2 microcontroller features 32-bit architecture, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications with CAN, Ethernet, I2C connectivity options and low power mode support.

Median Price

$19.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$19.250

1k+ parts

$17.220

10k+ parts

$16.210

7

-

$19.250

$17.220

$16.210

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,772 parts In-Stock

1+ parts

$20.320

100+ parts

-

1k+ parts

-

10k+ parts

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2,772

$20.320

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-

-

Vyrian

USA . 6,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,790

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$17.250

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$17.250

-

-

-

Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$18.180

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$18.180

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-

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Corphita

USA . 4,605 parts In-Stock

1+ parts

$19.251

100+ parts

-

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4,605

$19.251

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Parana Technologies

USA . 1,027 parts In-Stock

1+ parts

$23.387

100+ parts

$2,171.794

1k+ parts

$21.048

10k+ parts

-

1,027

$23.387

$2,171.794

$21.048

-

DigiPath Technology Company

USA . 797 parts In-Stock

1+ parts

$25.751

100+ parts

-

1k+ parts

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10k+ parts

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797

$25.751

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ChromeModa Solutions

Germany . 6,322 parts In-Stock

1+ parts

$26.277

100+ parts

$21.547

1k+ parts

-

10k+ parts

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6,322

$26.277

$21.547

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IDEA Electronic Components Group

UK . 19 parts In-Stock

1+ parts

$26.277

100+ parts

$24.963

1k+ parts

$23.649

10k+ parts

-

19

$26.277

$24.963

$23.649

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Microchip USA

USA . 328 parts In-Stock

1+ parts

-

100+ parts

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328

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Overview

Unlock the power of cutting-edge technology with the LM3S8930-IQC50-A2 by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers unrivaled quality and reliability. This versatile device is perfect for a wide range of applications, offering seamless connectivity and advanced features. Experience the value of increased efficiency and performance with this innovative product. Upgrade your projects today with the LM3S8930-IQC50-A2 and stay ahead of the curve.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps in improving data access speeds and overall performance of the microcontroller.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sets and perform more complex calculations efficiently.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family is known for its high performance and energy efficiency, making this microcontroller suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and devices, expanding its usability in various applications.

Connectivity: CAN, ETHERNET, I2C, SSI, UART

With support for multiple communication protocols, this microcontroller can easily communicate with a variety of external devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with simplified instruction set architecture, making it ideal for real-time processing tasks.

ROM Programmability: FLASH

The Flash programmability of the ROM allows for easy firmware updates and customization, making the microcontroller versatile for different applications.

Low Power Mode: YES

The presence of a low power mode helps in conserving energy and extending the battery life in battery-powered applications.

Technical Specifications

Microcontrollers LM3S8930-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

34

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C, SSI, UART

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S8930-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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