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LM3S8738-EQC50-A2T

Texas Instruments

LM3S8738-EQC50-A2T by Texas Instruments

Texas Instruments' LM3S8738-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it offers 38 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,882 parts In-Stock

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7,882

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Digiode

USA . 4,967 parts In-Stock

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4,967

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Distributors (Availability)

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One Stop Electronics

USA . 586 parts In-Stock

1+ parts

$4.000

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586

$4.000

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AZTECH Wire

Italy . 897 parts In-Stock

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$18.497

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897

$18.497

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Parana Technologies

USA . 1,997 parts In-Stock

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$32.094

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$97.561

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1,997

$32.094

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$97.561

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IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$36.061

100+ parts

$34.258

1k+ parts

$32.455

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523

$36.061

$34.258

$32.455

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ChromeModa Solutions

Germany . 300 parts In-Stock

1+ parts

$36.061

100+ parts

$29.570

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300

$36.061

$29.570

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QUARKTWIN TECHNOLOGY LTD

USA . 10,427 parts In-Stock

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Corphita

USA . 3,635 parts In-Stock

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DigiPath Technology Company

USA . 2,189 parts In-Stock

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$32.513

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$32.513

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Microchip USA

USA . 185 parts In-Stock

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185

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Overview

Discover the LM3S8738-EQC50-A2T by Texas Instruments, a top-quality microcontroller that offers unmatched performance and reliability. With a plethora of applications in various industries, this product is designed to meet the needs of even the most demanding projects. From its advanced technology to its durable construction, the LM3S8738-EQC50-A2T delivers exceptional value to customers looking for a reliable solution to their microcontroller needs. Trust in Texas Instruments to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

Provides a safe operating limit for the microcontroller, preventing damage from overvoltage.

Bit Size: 32

Offers a high processing capability, suitable for handling complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Compatibility with different power supplies provides flexibility in integration with various systems.

No. of Terminals: 100

Sufficient terminals for connecting peripherals and external components, enhancing the microcontroller's functionality.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions, ensuring long-term performance.

RAM Bytes: 65536

Generous RAM capacity for storing program data and variables, enabling efficient processing of tasks.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling updates and modifications to the firmware.

Speed: 50 rpm

Capable of handling tasks at a speed of 50 revolutions per minute, suitable for applications requiring precise control.

Technical Specifications

Microcontrollers LM3S8738-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

38

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8738-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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