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LM3S8530-IBZ50-A2T

Texas Instruments

LM3S8530-IBZ50-A2T by Texas Instruments

Texas Instruments LM3S8530-IBZ50-A2T microcontroller features 32-bit architecture, 50 MHz clock frequency, and 65536 bytes of RAM. Ideal for industrial applications requiring CAN, Ethernet, I2C connectivity with low power mode and integrated cache for enhanced performance.

Median Price

$36.562

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$32.500

1k+ parts

$29.080

10k+ parts

$27.370

1,000

-

$32.500

$29.080

$27.370

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$40.625

1k+ parts

$36.350

10k+ parts

$34.212

1,000

-

$40.625

$36.350

$34.212

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,083 parts In-Stock

1+ parts

$34.295

100+ parts

-

1k+ parts

-

10k+ parts

-

2,083

$34.295

-

-

-

Vyrian

USA . 6,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,188

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,564 parts In-Stock

1+ parts

$32.490

100+ parts

-

1k+ parts

-

10k+ parts

-

3,564

$32.490

-

-

-

Parana Technologies

USA . 1,403 parts In-Stock

1+ parts

$77.183

100+ parts

-

1k+ parts

-

10k+ parts

-

1,403

$77.183

-

-

-

ChromeModa Solutions

Germany . 2,911 parts In-Stock

1+ parts

$86.722

100+ parts

$71.112

1k+ parts

-

10k+ parts

-

2,911

$86.722

$71.112

-

-

IDEA Electronic Components Group

UK . 1,548 parts In-Stock

1+ parts

$86.722

100+ parts

$82.386

1k+ parts

$78.050

10k+ parts

-

1,548

$86.722

$82.386

$78.050

-

DigiPath Technology Company

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

$78.189

1k+ parts

-

10k+ parts

-

1,192

-

$78.189

-

-

Microchip USA

USA . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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166

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-

Overview

Unlock unprecedented performance and reliability with the LM3S8530-IBZ50-A2T by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers cutting-edge technology with integrated cache and advanced peripherals like timers, UART, and Ethernet connectivity. Ideal for industrial applications, this microcontroller boasts low power consumption and high-speed operation, making it an invaluable asset for your next project. Experience the difference with Texas Instruments and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product more affordable and easier to handle.

Integrated Cache: YES

The integrated cache helps improve the performance of the microcontroller by reducing access times to frequently used data.

Surface Mount: YES

Surface mount technology allows for a smaller form factor, making the product suitable for compact designs and applications.

Maximum Supply Voltage: 2.75 V

A lower maximum supply voltage helps in reducing power consumption and heat generation, making the product more energy-efficient.

Address Bus Width: 8

With an 8-bit address bus width, the microcontroller can access a larger memory space efficiently, enhancing its processing capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the microcontroller's firmware, making it flexible for future enhancements or bug fixes.

Connectivity: CAN(3), ETHERNET, I2C, SSI(2), UART

Multiple connectivity options such as CAN, Ethernet, I2C, SSI, and UART enable seamless integration with different communication protocols and devices, enhancing the product's versatility.

Technical Specifications

Microcontrollers LM3S8530-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

8

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), ETHERNET, I2C, SSI(2), UART

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S8530-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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