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LM3S828-IQN50-C2

Texas Instruments

LM3S828-IQN50-C2 by Texas Instruments

Texas Instruments LM3S828-IQN50-C2 microcontroller features 32-bit CPU, 8KB RAM, and 8-channel ADC. Ideal for industrial applications with -40 to 85°C operating range. Offers connectivity via I2C, SSI, UART(2) interfaces for versatile integration.

Median Price

$5.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$5.530

1k+ parts

$4.950

10k+ parts

$4.660

26

-

$5.530

$4.950

$4.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,641 parts In-Stock

1+ parts

$5.833

100+ parts

-

1k+ parts

-

10k+ parts

-

3,641

$5.833

-

-

-

Vyrian

USA . 4,412 parts In-Stock

1+ parts

-

100+ parts

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4,412

-

-

-

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Zilex Electronics Inc.

Canada . 188 parts In-Stock

1+ parts

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188

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,888 parts In-Stock

1+ parts

$5.526

100+ parts

-

1k+ parts

-

10k+ parts

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3,888

$5.526

-

-

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AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$15.770

100+ parts

-

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995

$15.770

-

-

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Parana Technologies

USA . 333 parts In-Stock

1+ parts

$36.659

100+ parts

-

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333

$36.659

-

-

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$40.366

100+ parts

-

1k+ parts

-

10k+ parts

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2,157

$40.366

-

-

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ChromeModa Solutions

Germany . 2,780 parts In-Stock

1+ parts

$41.190

100+ parts

$33.776

1k+ parts

-

10k+ parts

-

2,780

$41.190

$33.776

-

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$41.190

100+ parts

$39.130

1k+ parts

$37.071

10k+ parts

-

1,913

$41.190

$39.130

$37.071

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Microchip USA

USA . 468 parts In-Stock

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468

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A-Z Elektronik GmbH

Germany . 375 parts In-Stock

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375

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Overview

Upgrade your projects with the LM3S828-IQN50-C2 microcontroller from Texas Instruments - a top-tier manufacturer known for quality and reliability. With integrated cache, 32-bit processing power, and a wide range of peripherals including multiple timers and PWM channels, this microcontroller is perfect for industrial applications requiring high performance and low power consumption. Its compact size and versatile connectivity options make it ideal for a variety of projects. Trust in Texas Instruments to deliver the best in microcontrollers - choose the LM3S828-IQN50-C2 for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the microcontroller, making it durable and suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by reducing access times to frequently used data and instructions.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle higher power requirements and provide stable operation under varying voltage conditions.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and energy efficiency, making it a popular choice for embedded systems and IoT devices.

ADC Channels: YES

Analog to Digital Converters allow the microcontroller to interface with analog sensors and signals, expanding its capabilities for data acquisition and processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller allows for efficient instruction execution and better performance for real-time applications.

Maximum Clock Frequency: 0.032 MHz

The high clock frequency of 32 MHz enables fast execution of instructions and high-speed data processing, making this microcontroller suitable for demanding tasks.

ROM Programmability: FLASH

Flash memory allows for reprogramming and updating the firmware of the microcontroller, offering flexibility and scalability for future product enhancements.

Analog To Digital Convertors: 8-Ch 10-Bit

Having 8 channels with 10-bit resolution each provides high accuracy in converting analog signals to digital data, essential for precision measurements and sensor readings.

No. of Timers: 3

Multiple timers enable the microcontroller to manage time-based operations, such as scheduling tasks, generating PWM signals, and controlling external devices with precise timing.

Technical Specifications

Microcontrollers LM3S828-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

28

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S828-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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