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LM3S812-EGZ50-C2T

Texas Instruments

LM3S812-EGZ50-C2T by Texas Instruments

Texas Instruments LM3S812-EGZ50-C2T is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and 65536 ROM words. Operating at up to 8 MHz, it features PWM channels and ADC support for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,894 parts In-Stock

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4,894

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Digiode

USA . 3,260 parts In-Stock

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3,260

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Distributors (Availability)

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One Stop Electronics

USA . 1,282 parts In-Stock

1+ parts

$8.000

100+ parts

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1,282

$8.000

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AZTECH Wire

Italy . 327 parts In-Stock

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$12.540

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327

$12.540

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Parana Technologies

USA . 1,018 parts In-Stock

1+ parts

$48.794

100+ parts

$4,531.286

1k+ parts

$43.915

10k+ parts

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1,018

$48.794

$4,531.286

$43.915

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DigiPath Technology Company

USA . 781 parts In-Stock

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$53.728

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781

$53.728

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ChromeModa Solutions

Germany . 3,616 parts In-Stock

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$54.825

100+ parts

$44.956

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3,616

$54.825

$44.956

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IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$54.825

100+ parts

$52.084

1k+ parts

$49.342

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211

$54.825

$52.084

$49.342

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Corphita

USA . 4,579 parts In-Stock

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Microchip USA

USA . 2,146 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S812-EGZ50-C2T microcontroller by Texas Instruments. This high-quality device offers unmatched performance and reliability, ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value and benefits, making it the perfect choice for your next project. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Upgrade to the LM3S812-EGZ50-C2T today and experience the difference in quality and performance.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on a PCB, making the product suitable for automated assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage operations which can be beneficial for certain applications.

Package Shape: SQUARE

Square packages are easier to handle and provide better thermal performance compared to other shapes.

Bit Size: 32

Allows for processing larger data sets and performing complex calculations efficiently.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, making it compatible with a wide range of systems.

No. of Terminals: 48

Provides a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good mechanical protection and electrical performance.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower voltage levels, conserving power in battery-operated devices.

Maximum Operating Temperature: 105 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliability in harsh environments.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and routing, optimizing space utilization.

ROM Words: 65536

Ample ROM capacity for storing program instructions and data, suitable for diverse software applications.

Maximum Seated Height: 1 mm

Low-profile design facilitates compact product designs and minimizes overall system height.

Width: 6.875 mm

Narrow width helps in space-constrained applications where board real estate is limited.

Maximum Clock Frequency: 8 MHz

High clock frequency enables fast processing speeds and quick response times.

Length: 6.875 mm

Compact length helps in designing small form factor devices without compromising on functionality.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and improved performance for embedded systems.

RAM Bytes: 8192

Adequate RAM capacity for temporary data storage, facilitating multitasking and complex operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for energy-efficient operations.

Terminal Form: NO LEAD

Leadless terminal form factor enhances reliability and simplifies manufacturing processes.

Maximum Supply Current: 110 mA

Low supply current consumption for extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Integrated Pulse Width Modulation (PWM) channels for precise control of motor speeds and analog output signals.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and configuration changes without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB designs and improves signal integrity for reliable connections.

Speed: 50 rpm

Operates at a specific speed suitable for certain motor control applications and feedback systems.

No. of I/O Lines: 34

Sufficient I/O lines for interfacing with external devices and sensors, enabling versatile connectivity options.

Technical Specifications

Microcontrollers LM3S812-EGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S812-EGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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