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LM3S800-EGZ50-C2T

Texas Instruments

LM3S800-EGZ50-C2T by Texas Instruments

LM3S800-EGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a powerful yet compact chip carrier package with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,662 parts In-Stock

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5,662

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Digiode

USA . 3,714 parts In-Stock

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3,714

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Distributors (Availability)

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One Stop Electronics

USA . 1,573 parts In-Stock

1+ parts

$3.000

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1,573

$3.000

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AZTECH Wire

Italy . 666 parts In-Stock

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$16.076

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666

$16.076

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Parana Technologies

USA . 2,024 parts In-Stock

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$34.951

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2,024

$34.951

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DigiPath Technology Company

USA . 557 parts In-Stock

1+ parts

$38.486

100+ parts

$35.407

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557

$38.486

$35.407

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ChromeModa Solutions

Germany . 3,642 parts In-Stock

1+ parts

$39.271

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$32.202

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3,642

$39.271

$32.202

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IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$39.271

100+ parts

$37.307

1k+ parts

$35.344

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621

$39.271

$37.307

$35.344

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Corphita

USA . 3,575 parts In-Stock

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Microchip USA

USA . 2,959 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments LM3S800-EGZ50-C2T microcontroller. Crafted by a trusted manufacturer, this powerful device is perfect for a wide range of applications. Experience seamless performance and reliability with its cutting-edge technology. From robotics to IoT devices, this microcontroller offers unmatched value, benefits, and advantages to customers seeking quality and innovation. Take your projects to the next level with the LM3S800-EGZ50-C2T and see your ideas come to life like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operates reliably within a wide voltage range, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape enables easy placement and alignment on circuit boards.

Bit Size: 32

32-bit architecture offers increased processing power and performance capabilities.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures consistent and reliable operation.

No. of Terminals: 48

Plenty of terminals allow for connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and lightweight design suitable for portable devices.

Minimum Supply Voltage: 3 V

Can operate at a low minimum supply voltage of 3V, suitable for power-efficient applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range makes it suitable for industrial applications with potential heat exposure.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the microcontroller to function in extreme cold environments.

ADC Channels: YES

Built-in ADC channels provide analog-to-digital conversion capabilities, allowing for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position arrangement facilitates easier connections and PCB layout.

ROM Words: 65536

Large ROM capacity allows for storing and executing complex programs efficiently.

Maximum Seated Height: 1 mm

Low seated height enables slim and compact form factor designs.

Width: 6.875 mm

Narrow width saves space on the PCB, contributing to overall compact system design.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing and execution of tasks.

Length: 6.875 mm

Compact length makes the microcontroller suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture provides efficient and optimized code execution.

RAM Bytes: 8192

Ample RAM memory allows for temporary data storage and efficient multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering and ensures reliable electrical connections.

Maximum Supply Current: 110 mA

Low supply current consumption enables energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and reliability.

PWM Channels: YES

Presence of PWM channels allows for precise control of motor speed and other analog applications.

ROM Programmability: FLASH

ROM programmability through flash memory provides flexibility in updating and modifying firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB designs and precise connections.

Speed: 50 rpm

Speed of operation at 50 revolutions per minute indicates efficient processing capabilities.

No. of I/O Lines: 36

Sufficient I/O lines enable versatile input and output configurations for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S800-EGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S800-EGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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