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LM3S6633-IQC50-A2

Texas Instruments

LM3S6633-IQC50-A2 by Texas Instruments

LM3S6633-IQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

$16.180

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$14.000

1k+ parts

$12.530

10k+ parts

$11.790

30

-

$14.000

$12.530

$11.790

DigiKey

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$16.180

1k+ parts

-

10k+ parts

-

30

-

$16.180

-

-

Verical

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$17.500

1k+ parts

$15.662

10k+ parts

$14.738

30

-

$17.500

$15.662

$14.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,710 parts In-Stock

1+ parts

$14.782

100+ parts

-

1k+ parts

-

10k+ parts

-

4,710

$14.782

-

-

-

Vyrian

USA . 7,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,157

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,461 parts In-Stock

1+ parts

$14.004

100+ parts

-

1k+ parts

-

10k+ parts

-

3,461

$14.004

-

-

-

Parana Technologies

USA . 152 parts In-Stock

1+ parts

$42.810

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$42.810

-

-

-

DigiPath Technology Company

USA . 2,246 parts In-Stock

1+ parts

$47.139

100+ parts

$43.368

1k+ parts

-

10k+ parts

-

2,246

$47.139

$43.368

-

-

ChromeModa Solutions

Germany . 6,569 parts In-Stock

1+ parts

$48.101

100+ parts

$39.443

1k+ parts

-

10k+ parts

-

6,569

$48.101

$39.443

-

-

IDEA Electronic Components Group

UK . 687 parts In-Stock

1+ parts

$48.101

100+ parts

$45.696

1k+ parts

$43.291

10k+ parts

-

687

$48.101

$45.696

$43.291

-

Microchip USA

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Overview

Experience the cutting-edge technology of the LM3S6633-IQC50-A2 microcontroller by Texas Instruments, a leader in the industry. With a 32-bit architecture and a wide range of power supplies, this versatile device is ideal for a variety of applications. From embedded systems to IoT devices, this microcontroller offers unmatched performance and reliability. Trust Texas Instruments to deliver top-quality products that meet your needs. Upgrade to the LM3S6633-IQC50-A2 and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a range of 2.25V to 2.75V, making it ideal for low-power applications.

Bit Size: 32

32-bit architecture provides increased processing power and capability for more complex tasks and applications.

Power Supplies (V): 2.5, 3.3

Versatile power supply options allow for compatibility with a variety of voltage requirements, enhancing flexibility in design.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample connectivity options for interfacing with external components and peripherals.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for industrial or harsh environments.

ADC Channels: YES

Analog-to-digital converter channels enable accurate measurement and conversion of analog signals, expanding the range of applications for the microcontroller.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data or code, accommodating complex algorithms and applications.

RAM Bytes: 32768

Generous RAM capacity provides ample memory for data storage and manipulation, facilitating efficient operation of the microcontroller.

Technical Specifications

Microcontrollers LM3S6633-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6633-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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